Packaging film for display device

ABSTRACT

Provided is a packaging film for a display device, which includes a first region corresponding to a top surface of a backward diode equipped on a bottom surface of a display panel; and a second region extending from the first region and corresponding to a side surface of the backward diode. Due to the packaging film, a bezel region can be minimized.

BACKGROUND

1. Field of the Invention

The present application relates to a packaging film for a display devicewith which an improved display device can be embodied.

2. Discussion of Related Art

A display device is useful in various electronic products. For example,a device such as a liquid crystal display (LCD) is used in variousproducts including a mobile phone, a personal digital assistant (PDA),an electronic game console, a monitor and a TV.

Generally, a display device has a display panel displaying an image. Inaddition, most of the display devices include a backward diode equippedon a bottom surface of the display panel. For example, an LCD deviceincludes a back light unit (BLU) as a backward diode.

FIG. 1 is a cross-sectional diagram showing a display device, andparticularly, an LCD device, according to conventional art.

Referring to FIG. 1, the LCD device has an LCD panel 10 displaying animage. Generally, the LCD panel 10 is not self-emissive, and thusrealizes an image by receiving light from an external environment.Accordingly, a backlight unit 20 is equipped as a backward diode on abottom surface of the LCD panel 10.

The backlight unit 20 includes, for example, a light source 22 such as alight emitting diode (LED), a light guide plate 24 inducing lightemitted from the light source 22 to the LCD panel 10 and converting apoint light source generated from the light source 22 to a surface lightsource, and a diffuser sheet 26 diffusing light emitted from the lightguide plate 24.

In addition, the LCD panel 10 has a liquid crystal cell layer 12composed of liquid crystals changed in light transmittance due toapplication of an electrical signal. The LCD panel 10 transmits orblocks light by changing or maintaining a polarizing direction oflinearly polarized light transmitted by liquid crystals are penetratedaccording to arrangement of the liquid crystals. To this end, the LCDpanel 10 has an upper polarizing plate 14 formed on the liquid crystalcell layer 12 and a lower polarizing plate 16 formed under the liquidcrystal cell layer 12.

In addition, the conventional display device including the LCD deviceincludes a molding frame 30 to assemble component members. As shown inFIG. 1, a backlight unit 20 is stacked on a bottom surface of the LCDpanel 10, and then assembled and fixed by the molding frame 30 formed ofa resin.

For example, related techniques are disclosed in Korean Patent Nos.10-0824866, 10-0876236, 10-0876248 and 10-1178577.

However, the display device according to the conventional art has abezel B as shown in FIG. 1 due to the use of the molding frame 30 asdescribed above, and an area of the bezel B is also large. Due to such abezel B, a display on which an actual image is shown becomes smallerthan a surface area of the LCD panel 10.

In addition, the display device according to the conventional art mayhave problems in handling and assembly of the backward diode, that is,the backlight unit 20. For example, an assembling process using themolding frame 30 by inserting and fixing an optical member such as thelight guide plate 24 or the diffuser sheet 26 to the molding frame 30and stacking these components on the bottom surface of the LCD panel 10may take too much time, and the optical members 24 and 26 may bedamaged. Moreover, according to the assembly using the molding frame 30,a light leakage phenomenon may occur due to decreased sealability. Sucha problem may bring an increase in costs and a decrease in yield of thedisplay device, and have a bad influence on performance.

SUMMARY OF THE INVENTION

The present application is directed to providing a packaging film for adisplay device through which an improved display device can be embodied.The present application provides, for example, a packaging film for adisplay device that minimizes a bezel region.

One aspect of the present application provides a packaging film for adisplay device, which includes a first region corresponding to a topsurface of a backward diode equipped on a bottom surface of a displaypanel; and a second region extending from the first region andcorresponding to a side surface of the backward diode.

Another aspect of the present application provides a packaging film fora display device, which includes a first region corresponding to a topsurface of a display panel; and a second region extending from the firstregion and corresponding to a side surface of the display panel and aside surface of the backward diode equipped on a bottom surface of thedisplay panel.

According to a first embodiment of the present application, thepackaging film for a display device may have an in-plane retardation(R_(in)) of 30 nm or less.

According to a second embodiment of the present application, thepackaging film for a display device may have a thickness-directionretardation (R_(th)) of 35 nm or less.

According to a third embodiment of the present application, thepackaging film for a display panel may include a notch part formed on aboundary line between the first region and the second region.

According to a fourth embodiment of the present application, a thicknessof the packaging film for a display device may satisfy an area of thefirst region and the following Equation.

T [μm]=100×S [m² ]+a  [Equation]

In Equation, T is a thickness of the packaging film (unit: μm), S is anarea of the first region (width×length, unit: m²), and a is a numberfrom 15 to 130.

According to a fifth embodiment of the present application, thepackaging film for a display device may have at least one selected fromthe physical properties (a) to (c):

(a) tensile modulus of 1,200 MPa or more

(b) tensile strength of 40 MPa or more

(c) elongation of 20% or more

According to a sixth embodiment of the present application, thepackaging film may have a strain (E) according to the following Equationof 5% or less.

E (%)=[(L2−L1)/L1]×100  [Equation]

In the Equation, L1 is an initial length (width or length) of thepackaging film, and L2 is an extending length of the packaging filmafter being maintained for 24 hours by applying a load of 3 kg at 80° C.

According to a seventh embodiment of the present application, thepackaging film for a display device may further include a third regionextending from the second region and corresponding to a bottom surfaceof the backward diode. An overlap prevented part may be formed in thethird region.

According to an eighth embodiment of the present application, in thepackaging film for a display device, at least the second region of thesecond and third regions may have light impermeability.

According to a ninth embodiment of the present application, in thepackaging film for a display device, a light-impermeable part may beformed at an edge of the first region.

According to a tenth embodiment of the present application, thepackaging film for a display device may include a projecting part in thefirst region.

According to an eleventh embodiment of the present application, in thepackaging film for a display device, an adhesion-facilitating part maybe formed on a top surface of the first region.

According to a twelfth embodiment of the present application, in thepackaging film for a display device, a bottom surface of the firstregion may have a ribbed surface.

According to a thirteenth embodiment of the present application, thepackaging film for a display device may further include apressure-sensitive adhesive layer formed on the first region.

According to a fourteenth embodiment of the present application, thepackaging film for a display device may further include a polarizinglayer formed on the first region, and a pressure-sensitive adhesivelayer formed on the polarizing layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentapplication will become more apparent to those of ordinary skill in theart by describing in detail exemplary embodiments thereof with referenceto the adhered drawings, in which:

FIG. 1 is a cross-sectional view of a display device according to aconventional art;

FIG. 2 is a cross-sectional view of a display device according to anembodiment of the present application;

FIG. 3 is a cross-sectional view of a display device according to anembodiment of the present application;

FIG. 4 is a cross-sectional view of a display device according to anembodiment of the present application;

FIG. 5 is a plan view of a packaging film according to an embodiment ofthe present application;

FIG. 6 is a cross-sectional view taken along line A-A′ of FIG. 5;

FIG. 7 is a plan view of a packaging film according to an embodiment ofthe present application;

FIG. 8 is a plan view of a packaging film according to an embodiment ofthe present application;

FIG. 9 is a plan view of a packaging film according to an embodiment ofthe present application;

FIG. 10 is a cross-sectional view of a display device according to anembodiment of the present application;

FIG. 11 is a cross-sectional view of a display device according to anembodiment of the present application;

FIG. 12 is a cross-sectional view of a display device according to anembodiment of the present application;

FIG. 13 is a plan view of a packaging film according to an embodiment ofthe present application;

FIG. 14 is a cross-sectional view taken along line A-A′ of FIG. 13;

FIG. 15 is a plan view of a packaging film according to an embodiment ofthe present application;

FIG. 16 is a plan view of a packaging film according to an embodiment ofthe present application; and

FIG. 17 is a plan view of a packaging film according to an embodiment ofthe present application.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

In the specification, the term “and/or” includes at least one of thelisted components.

In the specification, the terms “first,” “second” and “third” are usedto discriminate one component from other components, and these elementsare not limited by these terms.

In the specification, the terms representing a direction such as “topsurface,” “side surface,” and “bottom surface” are, unless specificallydefined otherwise, based on directions of a display device seen by anobserver (viewer).

In the specification, the term “corresponding” means that surfacesfacing each other partially or entirely correspond to each other.

In the specification, the terms “formed on,” “formed above,” “formedunder,” and “formed on a side surface” do not only mean thatcorresponding components are stacked in direct contact with a differentsurface, but also include cases in which a different component is formedbetween the corresponding components. For example, the term “formed on”may indicate that a second component is formed in direct contact with afirst component, or that a third component is also formed between thefirst component and the second component.

In the specification, the term “extension” may not imply that any onecomponent (first component) is extended and formed in one process withanother component (second component), but may indicate that twocomponents (first and second components) are detachable members, andthus are extended by connection even when they are not formed in oneprocess.

In the specification, the term “light transmittance” may indicate thatradiated visible rays have a transmittance of 60% or more, for example,80% or more, for example, 90% or more on a straight line. In thespecification, the term “light impermeability” may indicate thatradiated visible rays have a transmittance of, for example, 40% or less,for example, 30% or less, for example, 20% or less, for example, 10% orless on a straight line.

Hereinafter, display devices according to first and second embodimentsof the present application will be described with reference to theaccompanying drawings. The accompanying drawings show exemplaryembodiments of the present application, and are provided to helpunderstanding of the present application. In the accompanying drawings,to clearly express various layers and areas, thicknesses areexaggerated, and the scope of the present application is not limited bythe thicknesses, sizes and ratios shown in the drawings. In descriptionof the present application, detailed descriptions of related knowngeneral functions or components will be omitted.

The present application provides packaging films 300 and 300′ to packagea display device. The packaging film 300 according to the firstembodiment of the present application is used to package a backwarddiode 200 equipped on a bottom surface of the display panel 100. Thepackaging film 300′ according to the second embodiment of the presentapplication is used to package a display panel 100 and a backward diode200. Further, the present application provides a display deviceincluding the packaging film 300 or 300′ according to the first orsecond embodiment of the present application. Exemplary examples of thepresent application will be described below.

First Embodiment

Examples of the packaging film 300 according to the first embodiment ofthe present application are shown in FIGS. 2 to 9.

The packaging film 300 according to the first embodiment of the presentapplication packages a backward diode 200 equipped on a bottom surfaceof a display panel 100. The packaging film 300 surrounds and packages atleast a top surface 201 and a side surface 202 of the backward diode200. To this end, the packaging film 300 includes a first region 310corresponding to the top surface 201 of the backward diode 200 and asecond region 320 corresponding to the side surface 202 of the backwarddiode 200. The second region 320 extends from the first region 310.

The display device includes the packaging film 300 described in thepresent application. According to an exemplary embodiment, the displaydevice includes a display panel 100, a backward diode 200 equipped on abottom surface of the display panel 100, a packaging film 300 forpackaging the backward diode 200, and a pressure-sensitive adhesivelayer 400 formed between the display panel 100 and the packaging film300. The pressure-sensitive adhesive layer 400 adheres and fixes thedisplay panel 100 to the packaging film 300.

According to the present application, an improved display device isembodied. For example, a bezel region is minimized by adhering andfixing the display panel 100 and the backward diode 200 using thepackaging film 300 and the pressure-sensitive adhesive layer 400.According to the present application, the use of a molding frame 30(refer to FIG. 1) may be excluded, and thus a display device havingalmost no bezel may be embodied. In addition, the problems generated inthe handling and assembly of the backward diode 200 are minimized oreliminated, for example, an optical diode on a film (or a sheet).

Hereinafter, in the explanation of an exemplary example of the firstembodiment, the packaging film 300 of the present application will alsobe explained during the explanation of the display device.

In the present application, the display panel 100 may be any one thatcan display an image without specific limitation.

The display panel 100 may include, for example, a component displayingan image by changing light transmittance, or a component displaying animage by emitting light from a fluorescent substrate. Particularly, thedisplay panel 100 may be selected from an LCD panel displaying an imageusing liquid crystals changed in light transmittance, a plasma displaypanel (PDP) displaying an image by generating gas discharging betweentwo electrodes and emitting light from a fluorescent substrate due to UVrays generated by the gas discharging, and/or an organicelectroluminescent display panel displaying an image by emitting lightfrom an organic light emitting diode (OLED) due to electric excitationoccurring in an electrode.

FIGS. 2 to 4 show display panels 100 according to exemplary embodimentsof the present application. FIGS. 2 to 4 specifically show LCD panels.

Referring to FIGS. 2 to 4, the display panel 100 includes, for example,at least one liquid crystal cell layer 120, and polarizing plates 140and 160 formed on both surfaces of the liquid crystal cell layer 120.The polarizing plates 140 and 160 may include an upper polarizing plate140 formed on the liquid crystal cell layer 120 and a lower polarizingplate 160 formed under the liquid crystal cell layer 120.

The liquid crystal cell layer 120 may include, for example, a thin filmtransistor (TFT) substrate, a color filter substrate facing the TFTsubstrate, and a liquid crystal cell interposed between the twosubstrates and in light transmittance is changed by applying anelectrical signal.

The upper polarizing plate 140 and the lower polarizing plate 160 mayhave a polarizing characteristic, and their optical axes may beorthogonal to each other. For example, the optical axis of the upperpolarizing plate 140 may be placed in a vertical direction of thedisplay panel 100, and the optical axis of the lower polarizing plate160 may be placed in a horizontal direction of the display panel 100. Inone example, the upper polarizing plate 140 and the lower polarizingplate 160 may each include a polarizer and a protective film formed onone or both surfaces of the polarizer. The polarizer may be selectedfrom, for example, polarizable polyvinylalcohol (PVA) films. Inaddition, the protective film may be a film including at least oneselected from, for example, triacetyl cellulose (TAC) and an acrylicresin. Other than these, a pixel electrode for driving a pixel may beformed in the display panel 100, and which is omitted from the drawing.

In addition, the display panel 100 may further include a differentfunctional film or layer, in addition to the liquid crystal cell layer120, the upper polarizing plate 140 and the lower polarizing plate 160.The display panel 100 may further include a light diffusion layer, aviewing angle compensation film, a retardation film, an anti-reflectionlayer, an anti-glare layer and/or a protective film layer for protectingthese components. Moreover, such films and layers may be formed on theupper polarizing plate 140 or the lower polarizing plate 160. Forexample, at least one selected from a light diffusion layer, ananti-reflection layer, an anti-glare layer and a protective film forprotecting these components may be further formed on the upperpolarizing plate 140. These components, as separate members, may bestacked on the upper polarizing plate 140, or may be directly formed ona top surface of the upper polarizing plate 140. As an example, theanti-glare layer may be directly formed on a top surface of the upperpolarizing plate 140 through surface treatment such as haze treatment.

In the present application, the backward diode 200 may be equipped on abottom surface of the display panel 100 without specific limitation. Thebackward diode 200 may be formed of one member, or have a multi-layerstructure including at least two members. Shapes and functions of themembers constituting the backward diode 200 are not limited. Thebackward diode 200 may have, for example, a form of a film, sheet,planar plate and/or a three-dimensional device. Particularly, forexample, the backward diode 200 may include at least one selected froman electric/electronic diode having an electric/electronic function, anoptical diode having an optical function, and/or a heat dissipationdiode having a heat dissipation function. Such a backward diode 200 issurrounded by a packaging film 300 as will be described below.

FIG. 2 shows a backward diode 200 composed of one member. Here, thebackward diode 200 shown in FIG. 2 may be selected from, for example, anoptical diode 200A, an electronic circuit board and a heat dissipationplate. Specifically, for example, the backward diode 200 may be selectedfrom the optical diode 200A.

In the present application, the optical diode 200A has an opticalfunction without limitation. The optical diode 200A may be, for example,a diode having functions such as diffusion, concentration, polarizationand/or reflection of light, but the present application is not limitedthereto. In addition, the optical diode 200A may include a light sourcegenerating light. In the specification, the optical diode 200A includesa light source generating light and/or all kinds of devices, filmsand/or sheets used to treat light.

The optical diode 200A may include, for example, at least one opticalmember 200 a selected from a light guide plate, a diffuser sheet, abrightness enhancement film, a prism film, a lens film, a polarizingfilm, a reflective film, a viewing angle compensation film, aretardation film and a protective film for protecting these components.In addition, the optical diode 200A may be selected from a light sourceassembly further including a light source 240 in the optical member 200a. Here, a particular shape of the light source assembly is notspecifically limited, and may be selected from conventional direct typeand edge type light source assemblies. For example, as the optical diode200A, the light source assembly may include a backlight unit (BLU)conventionally used in an LCD device.

In FIGS. 3 and 4, as the backward diode 200, the optical diode 200Ahaving a multi-layer structure is shown. Particularly, as the backwarddiode 200, the optical diode 200A including a plurality of opticalmembers 200 a is shown in FIG. 3, and an optical diode 200A including aplurality of optical members 200 a and a light source 240 is shown inFIG. 4.

Referring to FIG. 3, the optical diode 200A may include, as an opticalmember 200 a, a light guide plate 210 converting a point light sourceemitted from a light source into a surface light source; and a diffusersheet 220 formed on the light guide plate 210 and diffusing lightgenerated from the light guide plate 210. In addition, the optical diode200A may further include a brightness enhancement film 230 formed on thediffuser sheet 220. In addition, such an optical member 200 a may beformed alone or in a combination of at least two thereof. In FIG. 3, thebrightness enhancement film 230 is formed in a bilayer structure. Suchan optical diode 200A is, as shown in FIG. 3, packaged by a packagingfilm 300, and equipped on a bottom surface of the display panel 100.Here, in FIG. 3, the light source providing light to the light guideplate 210 is not shown, but the light source may be, for example,separately equipped at an outside, and provide light to the light guideplate 210.

In addition, referring to FIG. 4, as the backward diode 200, the opticaldiode 220A may include an optical member 200 a and a light source 240.In addition, these may be assembled, and then packaged by a packagingfilm 300. Particularly, the optical diode 200A is a light sourceassembly including the light source 240, and includes at least one lightsource 240 and an optical member 200 a formed on the optical source 240.A plurality of the optical members 200 a may be included, and each ofthe optical members 200 a may include a light guide plate 210 convertinga point light source emitted from the light source 240 into a surfacelight source; and a diffuser sheet 220 formed on the light guide plate210 and diffusing light generated from the light guide plate 210. Inaddition, as shown in FIG. 4, the optical diode 200A may further includea brightness enhancement film 230 formed on the diffuser sheet 220.

In the present application, the light source 240 may emit light withoutspecific limitation. The light source 240 may include, for example, alight emitting diode (LED). The light source 240 may include a pluralityof LEDs and a case in which the LEDs are built according to an exemplaryembodiment.

The packaging film 300 packages the above-described backward diode 200,for example, the optical diode 200A. Here, the light source 240 may notbe packaged by the packaging film 300 as shown in FIG. 3, or may bepackaged along with the optical member 200 a as shown in FIG. 4.

The packaging film 300 includes a first region 310, and a second region320 extending from the first region 310. Here, the first region 310corresponds to a top surface 201 of the backward diode 200, and thesecond region 320 corresponds to a side surface 202 of the backwarddiode 200. The packaging film 300 may further include a third region 330to obtain high fixing strength of the backward diode 200. The thirdregion 330 extends from the second region 320, and corresponds to abottom surface 203 of the backward diode 200. In FIGS. 5 to 9, exemplaryembodiments of the packaging film 300 are shown.

Among the regions 310, 320 and 330 of the packaging film 300, at leastthe first region 310 and the second region 320 may have areas which areequal or similar to a part corresponding to the backward diode 200. Forexample, the area of the first region 210 may be equal or similar tothat of the top surface 210 (refer to FIG. 2) of the backward diode 200,and the area of the second region 220 may be equal or similar to that ofthe side surface 202 (refer to FIG. 2) of the backward diode 200.

In addition, at least two second regions 320 may be included. Forexample, two to four second regions 320 are included. That is, thesecond region 320 may extend from the first region 310, and be formed onat least two of the four surfaces of the first region 310. In addition,for example, two to four third regions 330 are included, which may bethe same as the number of the second regions 320. For example, in FIG.5, three of the second regions 320 are formed, and the same number ofthe third regions 330 is formed.

In the present application, the packaging film 300 may be any onefurther including the first region 310 and the second region 320 asshown above, and preferably the third region 330 without limitation. Inaddition, the regions 310, 320 and 330 may be formed in one process. Thepackaging film 300 may be formed, for example, by cutting one sheet offilm to have three regions 310, 320 and 330, thereby forming the regions310, 320 and 330 in one process.

The packaging film 300 may be selected from resin films, and a kind ofthe resin film is not limited. The packaging film 300 may be, forexample, a film including at least one resin selected from apolycarbonate (PC)-based resin, a polyester-based resin, apolyolefin-based resin, a cyclo-olefin polymer (COP)-based resin, anacrylic resin, a urethane-based resin, an epoxy-based resin, apolyamide-based resin, a cellulose-based resin, a nylon-based resin anda derivative thereof. Particularly, the packaging film 300 may be, butis not limited to, a PC film, a polyethyleneterephthalate (PET) film, apolyethylenenaphthalate (PEN) film, a polybutyleneterephthalate (PBT)film, a polybutylenenaphthalate (PBN) film, a polyethylene (PE) film, apolypropylene (PP) film, a cyclic PE film, a cyclic PP film, an acrylicfilm, a triacetyl cellulose (TAC) film and/or a nylon film. In addition,the listed films may be stretched or non-stretched. The packaging film300 is preferably a non-stretched PC film or a non-stretched PET film.

The packaging film 300 may have light transmittance. In addition, thepackaging film 300 may have optical properties including lightpolarizing, concentrating and/or diffusing properties as needed, and insome cases, may have isotropy. At least the first region 310 can havesuch characteristics. In this case, the first region can be useful inpackaging of the optical diode 200A.

In the present application, isotropy means that the film does not haveretardation, or only has an insignificant retardation to such an extentthat does not have a substantial influence on a phase of lightpenetrating the film.

The packaging film 300 may have an in-plane retardation (R_(in)) of 30nm or less according to the first embodiment of the present application.When the in-plane retardation (R_(in)) exceeds 30 nm, it can have aninfluence on a phase of light penetrating the film 300. The packagingfilm 300 may have, for example, an in-plane retardation (R_(in))calculated by Equation 1 of 30 nm or less, 25 nm or less, or 10 nm orless, and particularly, for example, 0 to 25 nm, 0 to 10 nm, 0.1 to 5nm, 0.2 to 3 nm, or 0.5 to 2 nm.

In addition, the packaging film 300 may have a thickness-directionretardation (R_(th)) of 35 nm or less according to the second embodimentof the present application. When the thickness-direction retardation(R_(th)) exceeds 35 nm, it can have an influence on a phase of lightpenetrating the film 300. The packaging film 300 may have, for example,a thickness-direction retardation (R_(th)) calculated by Equation 2 of35 nm or less, 30 nm or less, 20 nm or less, or 10 nm or less, andparticularly, for example, 0 to 30 nm, 0 to 20 nm, 0 to 10 nm, 0.1 to 5nm, or 0.2 to 3 nm. In the present application, the retardations R_(in)and R_(th) have absolute values.

R _(in) =d×(nx−ny)  [Equation 1]

In Equation 1, R_(in) is an in-plane retardation, d is a thickness ofthe packaging film 300, nx is a refractive index in a slow axisdirection of the packaging film 300 with respect to light with awavelength of 400 to 600 nm, and ny is a refractive index in a fast axisdirection of the packaging film 300 with respect to a wavelength of 400to 600 nm.

R _(th) =d×(ny−nz)  [Equation 2]

In Equation 2, Rth is thickness-direction retardation, d is a thicknessof the packaging film 300, ny is a refractive index in a fast axisdirection of the packaging film 300 with respect to light with awavelength of 400 to 600 nm, and nz is a refractive index in a thicknessdirection of the packaging film 300 with respect to light with awavelength of 400 to 600 nm.

The packaging film 300 may be selected from, for example, anon-stretched PC-based film, a non-stretched polyester-based film, anon-stretched acrylic film, a non-stretched TAC-based film and/or anon-stretched cyclic polyolefin-based film to satisfy such retardation.

During packaging of the backward diode 200, the regions 310, 320 and 330are bent at boundary lines C1 and C2. In the drawings, the boundarylines C1 and C2 between the areas 310, 320 and 330 are represented bydotted lines. Here, the boundary lines C1 and C2 are represented forconvenience of descriptions, and thus may or may not actually be visibleon the packaging film 300.

To package the backward diode 200 using the packaging film 300, forexample, first, the first region 310 is placed to correspond to a topsurface 201 of the backward diode 200, and the second region 320 isplaced to correspond to a side surface 202 of the backward diode 200 bybending the second region 320 on the first boundary line C1. Inaddition, when the third region 330 is further included, the thirdregion 330 is placed to correspond to the bottom surface 203 of thebackward diode 200 by bending the third region 330 on the secondboundary line C2 before packaging.

According to an exemplary embodiment, the packaging film 300 and thebackward diode 200 may have adhesive strength to each other. Theadhesive strength may be present, for example, at a contact interfacebetween the packaging film 300 and the backward diode 200. A method ofadhering the packaging film 300 to the backward diode 200 is notspecifically limited, and may be performed, for example, by applying athermal and/or optical laminating method. For example, the packagingfilm 300 may be fused to the backward diode 200 by applying heat orradiating light to the packaging film 300. Here, in the packaging film300, at least one selected from the second region 320 and the thirdregion 330 may have adhesive strength to the backward diode 200. Duringadhesion through lamination, conditions for radiating heat or light maybe suitably selected according to a kind of the packaging film 300, butthe present application is not specifically limited thereto.

In another embodiment of the present application, the packaging film 300and the backward diode 200 may have adhesive strength therebetweenthrough a separate adhesive means. The adhesive means may be, forexample, a pressure-sensitive adhesive layer (not shown) formed betweenthe packaging film 300 and the backward diode 200. To discriminate sucha pressure-sensitive adhesive layer from a pressure-sensitive adhesivelayer 400 formed between the packaging film 300 and the display panel100, the pressure-sensitive adhesive layer is referred to as a secondpressure-sensitive adhesive layer.

The second pressure-sensitive adhesive layer is preferably formed at acontact interface between the packaging film 300 and the backward diode200 to provide adhesive strength therebetween. Such a secondpressure-sensitive adhesive layer may be coated on the packaging film300 and/or the backward diode 200. For example, the secondpressure-sensitive adhesive layer may be formed on at least one selectedfrom the second region 320 and the third region 330. Particularly, thesecond pressure-sensitive adhesive layer may be formed on an innersurface of at least the second region 320 and/or the third region 330 ofthe regions 310, 320 and 330 of the packaging film 300.

As described above, the packaging film 300 and the backward diode 200may be adhered between at least the second region 320 and the sidesurface 202 and/or between the third region 330 and the bottom surface203 through fusion by heat and/or light or adhesion using the secondpressure-sensitive adhesive layer.

In addition, the adhesive means may be, for example, a double-sided orsingle-sided pressure-sensitive adhesive tape. Here, the double-sidedpressure-sensitive adhesive tape may be interposed between the packagingfilm 300 and the backward diode 200. Particularly, the double-sidedpressure-sensitive adhesive tape may be interposed between the secondregion 320 and the side surface 202, and/or between the third region 330and the bottom surface 203. In addition, for example, an outer surfaceof the third region 330 may be taped with the single-sidedpressure-sensitive adhesive tape to provide binding strength to thebackward diode 200.

Referring to FIGS. 5 and 6, according to a third embodiment of thepresent application, a notch part 350 may be formed on a boundary lineC1 between the first region 310 and the second region 320. In addition,when the packaging film 300 further includes a third region 330, thenotch part 350 may also be formed on a boundary line C2 between thesecond region 320 and the third region 330. FIG. 6 is a cross-sectionalview taken along line A-A′ of FIG. 5.

In the present application, the notch part 350 may be any one processedto easily bend the second region 320 and the third region 330 on theboundary lines C1 and C2, respectively. The notch part 350 may be formedthrough, for example, notch treatment capable of generating a thicknessdifference between the boundary lines C1 and C2. Particularly, the notchpart 350 may be selected from imprinted parts formed by pressing theboundary lines C1 and C2, and half-cut parts formed by half-cutting theboundary lines C1 and C2. In the present application, the “half” doesnot mean only a half of the thickness of the packaging film 300.

The notch part 350 may be formed to a depth of, for example, ⅓ to ⅔ ofthe thickness of the packaging film 300 through folding line imprintingor half-cutting. Here, when the depth of the notch part 350 is less than⅓, for example, in some cases, breakage may occur. When the depth ismore than ⅔, it may be somewhat difficult to bend.

In addition, the notch part 350 may be continuously formed along theboundary lines C1 and C2, or discontinuously formed at a predeterminedinterval. That is, the notch part 350 may be discontinuously formed by adotted line representing the boundary lines C1 and C2. In anotherexample, the notch part 350 may be selected from a plurality ofmicropores perforated at a predetermined interval along the boundarylines C1 and C2, and in the present application, the notch part 350 maybe, but is not specifically limited to, any one processed to easily bendthe regions 310, 320 and 330 on each boundary line C1 or C2 as describedabove.

In addition, the regions 310, 320 and 330 may have a bending strengthof, for example, 1.0 to 10.0 gf on each boundary line C1 or C2. Suchbending strength may be set by the notch part 350. Here, when thebending strength is less than 1.0 gf, the regions 310, 320 and 330 areeasily bent on the boundary line C1 or C2 or overlapped, and thus can bedifficult to handle. In addition, when the bending strength is more than10.0 gf, a bending process may not be facilitated. Considering these,the regions 310, 320 and 330 may have a bending strength of, forexample, 2 to 8 or 3 to 6 gf on each boundary line C1 or C2. The bendingstrength may be, for example, a value measured according to ASTM D790.

The thickness of the packaging film 300 is not specifically limited. Thethickness of the packaging film 300 may be variously set inconsideration of supporting strength, bending processability of eachregion 310, 320 or 330, handleability in packaging, and/or thinning ofthe film 300.

According to a fourth embodiment of the present application, thethickness of the packaging film 300 may satisfy an area of the firstregion 310 and Equation 3.

T [μm]=100×S [m² ]+a  [Equation 3]

In Equation 3, T is a thickness (unit: μm) of the packaging film 300, Sis an area (width×length, unit: m²) of the first region 310, and a is anumber from 15 to 130. Here, a includes a decimal as well as an integer.

When the thickness of the packaging film 300 satisfies Equation 3, it isadvantageous in terms of the supporting strength; the bendingprocessability of each region 310, 320, or 330; handleability inpackaging, and/or the thinning of the film 300.

In Equation 3, S is an area of the first region 310, which may also bean area of the top surface of the backward diode 200 corresponding tothe first region 310. In another example, S of Equation 3 may be an areaof a top surface of the display panel 100. Generally, a display devicesuch as a TV or a monitor may be inclined toward a wall at an angle ofapproximately 10 degrees when equipped on the wall. Here, when thethickness of the packaging film 300 is too small to satisfy Equation 3,the packaging film 300 may droop or project forward due to a lowsupporting strength. In addition, when the thickness of the packagingfilm 300 is too large to satisfy Equation 3, the bending processabilityof each region 310, 320 or 330 may decrease due to unnecessarily highstrength, and a separated part may be generated after bending, which maybe disadvantageous in terms of thinning of the film. Considering this,it is preferable that the thickness of the packaging film 300 satisfiesEquation 3.

The thickness of the packaging film 300 may vary depending on the areaof the first region 310, and the thickness may be, for example, in therange from approximately 20 to 500 μm, 30 to 400 μm, or 35 to 200 μm.

In addition, according to a fifth embodiment of the present application,the packaging film 300 may have at least one physical property selectedfrom (a) a tensile modulus of 1,200 MPa or more, (b) a tensile strengthof 40 MPa, and (c) an elongation of 20%. When the packaging film 300 hassuch a physical property, the backward diode 200 may be packaged andsupported well.

Although this differs depending on the backward diode 200, for example,when a tensile modulus is less than 1,200 MPa or a tensile strength isless than 40 MPa, supporting strength of the backward diode 200 maybecome insignificant. The upper limits of the tensile modulus and thetensile strength are not specifically limited. Particularly, thepackaging film 300 may have a tensile modulus of 1,200 to 5,000 MPa,1,500 to 4,000 MPa, 1,800 to 3,000 MPa, 1,900 to 2,500 MPa, or 2,000 to2,400 MPa. In addition, the packaging film 300 may have, for example, atensile strength of 40 to 200 MPa, 45 to 150 MPa, 50 to 100 MPa, or 55to 75 MPa. Moreover, when an elongation is less than 20%, for example,the handleability in packaging may be degraded. The upper limit of theelongation is not limited, but in consideration of the supportingstrength of the backward diode 200, for example, the elongation may be200% or less. Considering this, the packaging film 300 may have, forexample, an elongation of 20% to 200%, 30% to 180%, 50% to 180%, or 80%to 150%.

Methods of measuring the tensile modulus, tensile strength andelongation are not limited. For example, the tensile modulus and thetensile strength may be values measured by a tensile tester generallyused in the film manufacturing field. In addition, the elongation may bea value calculated through an equation [Elongation (%)=(A−B)/A×100] bysetting an initial gauge length of the film 300 as A and a gauge lengthat a broken time after elongation as B in a tensile tester.

In addition, the packaging film 300 preferably has a small strain forhigh supporting strength, fixing strength and/or durability. Thepackaging film 300 may have a strain (E) obtained by Equation 4 of 5% orless according to a sixth embodiment of the present application.

E (%)=[(L2−L1)/L1]×100  [Equation 4]

In Equation 4, L1 is an initial length (width or length) of thepackaging film 300, and L2 is an extending length of the packaging film300 after being maintained for 24 hours while applying a load of 3 kg at80° C.

As described above, the display device may be inclined toward a wall atan angle of approximately 10 degrees. Here, when the strain (E) of thepackaging film 300 according to Equation 4 is more than 5%, thepackaging film may droop or project forward due to a load of the displaydevice. Particularly, the packaging film 300 may have a strain (E) of 4%or less, 3.5% or less, 3.2% or less, 3% or less, 2.5% or less, 2% orless, 1.5% or less, or 1% or less. It is preferable that the strain (E)of the packaging film 300 be closer to 0.

In one example, the packaging film 300 may be selected from films whichare elongated approximately 2 mm or less in a length or width direction,when maintained at 80° C. under a load of 3 kg for 24 hours, based on asize of 60 mm×25 mm (width×length).

Moreover, the packaging film 300 may have folding endurance, when afolding number (MIT) measured by a test defined by JIS P8115 is, forexample, 200 times or more, 300 times or more, or 400 times or more.

In addition, referring to FIG. 5, according to a seventh embodiment ofthe present application, the third region 330 may have an overlapprevented part 360. That is, the overlap preventing part 360 may beformed in the third region 330 to prevent overlap between adjacent thirdregions 330 when the third region 330 is bent to be adhered to thebottom surface 203 of the backward diode 200.

The overlap prevented part 360 may be selected from a notched part 361cut, for example, at a predetermined angle (θ). Here, the angle (θ) ofthe notched part 361 may be, for example, 15 to 85 degrees or 30 to 60degrees. Particularly, the angle (θ) of the notched part 361 may be 30degrees or more, or 45 degrees of more. Due to such a notched part 361,the overlapping of the adjacent third regions 330 may be prevented. Inthe present application, as shown in FIG. 5, the angle (θ) of thenotched part 361 is an angle of incline between an extension line a anda side surface of the third region 360 based on the extension line (a)extending in a straight line direction in the second region 320.

FIG. 7 shows the overlap prevented part 360 according to anotherembodiment. Referring to FIG. 7, the overlap prevented part 360 may beselected from cut parts 362 cut to a predetermined length L and thenremoved. Here, the length L of the cut part 362 may be, for example,larger than or the same as a width (W₃₃₀) of the third region 330. Theoverlapping of the adjacent third regions 330 may be prevented by such acut part 362.

According to an exemplary embodiment, among the regions 310, 320 and330, at least the first region 310 may have light transmittance(transparency). The first region 310 may have, for example, a lighttransmittance of 80% or more, particularly, 90% or more. In this case,it is advantageous to package the optical diode 200A.

In addition, according to an eighth embodiment of the presentapplication, among the second and third regions 320 and 330, at leastthe second region 320 may have light impermeability. That is, since thesecond region 320 has light transmittance, light leakage to the sidesurface thereof may be prevented. The second region 320 may have a lightimpermeability of, for example, 10% or less, 5% or less, 1% or less,0.1% or less, or 0%. In the present application, the lightimpermeability includes a light shielding property of blocking lightand/or a light reflecting property of reflecting light. For such lightimpermeability, at least the second region 320 may include, for example,at least one light leakage preventing layer selected from a lightshielding layer and a reflective layer. In addition, the third region330 may also selectively have light impermeability.

The light shielding layer may be formed, for example, by coating a lightshielding material on the second region 320. In addition, the reflectivelayer may be formed by, for example, a reflective material may be coatedon the second region 320. The term “coating” used herein includes acoating method such as printing or deposition, in addition to, generalcoating such as bar coating or spray coating.

Materials constituting the light shielding or reflective layer are notspecifically limited. A light shielding material may be a materialexhibiting a color such as black, and particularly, an inorganic ororganic material selected from carbon black, graphite, iron oxide, anazo-based pigment and/or a phthalocyanine-based pigment. In addition,the reflective material may be, for example, a metal or metal oxideselected from aluminum, titanium, silica, alumina and/or titania. Suchlight shielding and reflective materials may be blended with a binderand/or solvent and coated by printing. In addition, the metal or metaloxide for reflectivity may be coated through deposition.

Referring to FIG. 8, according to a ninth embodiment of the presentapplication, a light impermeable part 314 may be formed at an edge ofthe first region 310. Particularly, as shown in FIG. 8, the first region310 may have a main transparent region 312, and also have a lightimpermeable part 314 formed along the edge thereof. The lightimpermeable part 314 may have light impermeability (light leakagepreventability). For example, the light impermeable part 314 may beselected from a printed layer formed by printing a light impermeablepaint. Moreover, the light impermeable part 314 may be selected from theabove-described light shielding and reflective layers. For example, thelight impermeable part 314 may be formed by coating a light shieldingmaterial (colored material) such as an inorganic or organic materialselected from carbon black, graphite, iron oxide, an azo-based pigmentand a phthalocyanine-based pigment.

When the light impermeable part 314 is formed at the edge of the firstregion 310 as described above, light leakage to the side surface may becompletely prevented. Although the light leakage to the side surface isprevented due to the light impermeability of the second region 320, itmay occur and there may be allowance in some cases, for example, if thepackaging film 300 is not exactly bent on the boundary lines C1 and C2.In addition, during the packaging of the packaging film 300, the firstregion 310 is lopsided, and thus the edge of the first region 310 islocated on a side surface of the optical diode 200A, thereby generatinglight leakage to the side surface. In such a case, the light leakage tothe side surface may be completely prevented since light is shielded bythe light impermeable part 314.

A width (W₃₁₄) and a thickness of the light impermeable part 314 are notspecifically limited. The width (W₃₁₄) may be, for example, 0.01 mm ormore. Here, the width (W₃₁₄) is less than 0.01 mm, a function ofpreventing allowance may be insignificant. The upper limit of the widthis not specifically limited, but when the width (W₃₁₄) is too large, ascreen may be excessively covered, and thus the width is preferably, forexample, 10 mm or less. In consideration of this, the light impermeablepart 314 may have a width (W₃₁₄) of, for example, 0.02 to 5 mm, andparticularly, for example, 0.03 to 3 mm. In addition, an area of thelight impermeable part 314 may be, for example, 0.01 to 5%, andparticularly, 0.5 to 2% of a total area of the first region. Inaddition, a thickness of the light impermeable part 314 may be, forexample, 200 μm or less, and particularly, for example, 0.01 to 200 μm,or 0.02 to 100 μm.

Referring to FIG. 9, according to a tenth embodiment of the presentapplication, the first region 310 may include a projected part 315 inwhich the second region 320 does not extend. Particularly, as shown inFIG. 9, the second region 320 may extend from the first region 310, notfrom a vertex 310 a thereof, to have a step difference 316, and thus thefirst region 310 may include a projecting part 315. That is, the vertex310 a of the first region 310 may be projected.

When the projected part 315 is included as described above, that is,when the projected part 315 in which the second region 320 does notextend from the first region 310 is included, stress caused in thebending of the second region 320 may be prevented. Although this dependson mechanical properties or thickness of the packaging film 300, asshown in FIG. 5, when there is no projected part 315 formed byprojecting the vertex 310 a, a part around the vertex 310 a of the firstregion 310 may be separated by applying stress when the second region320 is bent. However, when the projected part 315 is included, theseparation phenomenon may be prevented.

Referring to FIGS. 2 to 4, the packaging film 300 is adhered and fixedto the display panel 100 through the pressure-sensitive adhesive layer400.

According to an eleventh embodiment of the present application, adhesivesurface treatment may be performed on a top surface of the packagingfilm 300. Particularly, an adhesive surface treated part may be formedon a top surface of at least the first region 310, that is, a surface(an upper surface in the drawing) in contact with the pressure-sensitiveadhesive layer 400. In the present application, the adhesive surfacetreatment is not limited as long as it can improve adhesive strengthbetween the packaging film 300 and the pressure-sensitive adhesive layer400. Due to such adhesive surface treatment, adhesive strength isimproved at a contact interface between the packaging film 300 and thepressure-sensitive adhesive layer 400, and thus fixing strength betweenthe display panel 100 and the packaging film 300 is increased.

The adhesive surface treatment may be, at least one selected from, forexample, corona treatment and primer treatment. Methods for the coronatreatment and the primer treatment are not be specifically limited, andmay be arbitrary known methods for improving adhesive strength in filmprocessing. For example, the primer treatment may be a method of forminga primer layer by coating an acryl-based, urethane-based, or epoxy-basedprimer. In addition, the primer layer may have a thickness of, forexample, 0.01 to 50 μm.

In addition, according to a twelfth embodiment of the presentapplication, a bottom surface of the packaging film 300 may have aribbed surface. Particularly, a ribbed surface may be formed on a bottomsurface of the first region 310, that is, a surface (a lower surface inthe drawing) in contact with the backward diode 200. Due to such aribbed surface, after packaging, fusion between the first region 310 andthe backward diode 200 may be prevented. More particularly, referring toFIG. 3, the fusion between a bottom surface (lower surface in thedrawing) of the first region 310 and a top surface (upper surface in thedrawing) of a brightness enhancement film 230 may be prevented.

The ribbed surface may be formed by various methods, for example, a mattreatment and a haze treatment. By such a treatment, the ribbed surfacemay have a roughness, for example, an RMS roughness of, for example, 0.1μm or more, 0.5 μm or more, or 1.0 μm or more, and preferably, forexample, approximately 0.1 to 10 μm, 0.5 to 8 μm, or 1.0 to 5 μm. Inaddition, the ribbed surface may have a haze of 80% or less, or 70% orless, and preferably, approximately 40% to 80% or 50% to 70%.

In addition, according to a case, the ribbed surface may be ahigh-hardness surface having high hardness, for example, pencil hardnessof 1 B or more, or 2 B or more, and preferably, approximately 1 B to 4 Bor 2 B to 4 B.

When the ribbed surface has a roughness (RMS roughness) and/or a pencilhardness in the above-exemplified ranges, the fusion between the firstregion 310 and the backward diode 200 may be effectively prevented.

In addition, the ribbed surface may be formed using, for example, aresin layer. For example, in the process of forming a resin layer, theribbed surface may be formed by an imprinting process or a method oftransferring a ribbed cast, or a method of including beads which canform ribs in a resin layer having a suitable thickness.

The resin layer may include, for example, a room temperature-curable,moisture-curable, heat-curable or photocurable resin composition in acured state. In one example, the resin layer may include a heat-curableor photocurable resin composition, or include a photocurable resincomposition in a cured state. Here, the room temperature-curable,moisture-curable, heat-curable or photocurable resin composition mayrefer to a resin composition cured at room temperature, or in a suitablehumidity, by applying heat or radiating active energy rays.

For example, the resin composition may include an acryl compound, anepoxy compound, a urethane compound, a phenol compound or a polyestercompound as a main material. Here, the “compound” may be a monomer,oligomer or polymer compound.

In another example, as the resin composition, an acrylic resincomposition having an excellent optical property such as transparencyand excellent resistance to yellowing, for example, a photocurableacrylic resin composition, may be used. The photocurable acryliccomposition may include, for example, an active energy ray-polymerizablepolymer component and a reactive monomer for dilution.

Here, as the polymer component, a component known as a so-called activeenergy ray-polymerizable oligomer such as urethane acrylate, epoxyacrylate, ether acrylate or ester acrylate, or a polymerized product ofa mixture including a monomer such as a (meth)acrylic acid ester monomermay be used. Here, as the (meth)acrylic acid ester monomer, an alkyl(meth)acrylate, a (meth)acrylate having an aromatic group, aheterocyclic (meth)acrylate or an alkoxy (meth)acrylate may be used.

As the reactive monomer for dilution which can be included in thephotocurable acrylic composition, a monomer having one or at least twophotocurable functional groups, for example, an acryloyl group, amethacryloyl group, etc. may be used. As the reactive monomer fordilution, for example, the (meth)acrylic acid ester monomer or amultifunctional acrylate may be used.

Selection of the component to prepare the photocurable acryliccomposition or a ratio of blending the selected component is notspecifically limited, and may be controlled in consideration of hardnessand other physical properties of a desired resin layer.

Ribs may be formed in the resin layer by a suitable method in theprocess of forming a resin layer using the resin composition, or aribbed surface may be embodied by including beads in the resin layer.Here, when beads are included, the beads may have a refractive indexdifferent from or substantially equal to that of the resin layer. Whenthe beads have a refractive index different from that of the resinlayer, a subsidiary effect of inducing light diffusion through the resinlayer may also be obtained.

A shape of the beads included in the resin layer may be, but is notspecifically limited to, for example, a spherical, oval, polygonal, oramorphous shape, or another shape. As a particular kind of beads,various inorganic or organic beads may be used. As inorganic beads,silica, amorphous titania, amorphous zirconia, indium oxide, alumina,amorphous zinc oxide, amorphous cerium oxide, barium oxide, calciumcarbonate, amorphous barium titanate or barium sulfate may be used, andas organic beads, particles including a crosslinked or non-crosslinkedproduct of an organic material such as an acrylic resin, a styreneresin, a urethane resin, a melamine resin, a benzoguanamine resin, anepoxy resin or a silicon resin may be used, but the present applicationis not limited thereto.

In addition, a method of forming a ribbed surface in the resin layerwithout using beads is not specifically limited. For example, the ribbedsurface may be embodied by curing the resin composition in a state inwhich a coating layer of the resin composition is in contact with a moldhaving a desired ribbed structure, or by an imprinting method.

In some cases, a resin composition is prepared for the resin layer tohave high hardness, and allows the resin layer to serve as ahigh-hardness layer. In this case, the resin layer may be controlled tohave hardness, for example, pencil hardness in the above-describedrange.

In the present application, the pressure-sensitive adhesive layer 400may be formed between the display panel 100 and the packaging film 300to adhere and fix. The pressure-sensitive adhesive layer 400 may becoated on the packaging film 300, that is, the first region 310 of thepackaging film 300. In addition, the pressure-sensitive adhesive layer400 may be coated on the display panel 100, for example, on a lowerpolarizing plate 160. In another example, the pressure-sensitiveadhesive layer 400 may be formed by a transferring method. That is, thepressure-sensitive adhesive layer 400 may be formed by being coated on aseparate releasing film, and being transferred onto the display panel100 or the packaging film 300. The pressure-sensitive adhesive layer 400may have a light transmittance of, for example, 80% or more.

The pressure-sensitive adhesive layer 400 may be formed of apressure-sensitive adhesive composition. Here, the pressure-sensitiveadhesive composition is as follows. The pressure-sensitive adhesivecomposition may also be applied to a second pressure-sensitive adhesivelayer, as well as the pressure-sensitive adhesive layer 400.Particularly, the pressure-sensitive adhesive composition which will bedescribed below may also be applied to the second pressure-sensitiveadhesive layer formed between the packaging film 300 and the backwarddiode 200 to provide adhesive strength therebetween, as well as thepressure-sensitive adhesive layer 400 formed between the display panel100 and the packaging film 300.

In the present application, the pressure-sensitive adhesive compositionincludes, for example, a photocurable and/or heat-curable type. Thepressure-sensitive adhesive composition may include, for example, amonomer and/or polymer component. The monomer and polymer components mayform a base of the pressure-sensitive adhesive layer through curing. Theterm “polymer” used herein refers to a compound prepared by polymerizingat least two monomers, and also includes, for example, a componentgenerally called an oligomer. In the field of preparingpressure-sensitive adhesives, various monomer and polymer componentsused to prepare the pressure-sensitive adhesive compositions are known,and such components are not limited. The monomer and polymer include,for example, acryl-based, urethane-based, and/or epoxy-based monomersand polymers.

In the heat-curable pressure-sensitive adhesive composition, the monomerand polymer components may be, for example, acrylic monomers andpolymers each having a crosslinkable functional group. The acrylicpolymer may be, for example, a polymer having a weight average molecularweight (Mw) of approximately 1,500,000 or more, and a glass transitiontemperature of approximately −24 to −16° C. A specific kind of thepolymer may be, but is not specifically limited to, a polymerconventionally used as a pressure-sensitive adhesive resin, for example,an acrylic polymer including a (meth)acrylic acid alkyl ester and acopolymerizable monomer capable of providing a crosslinkable functionalgroup on a side chain or terminal end of the polymer. Here, as aparticular example of the (meth)acrylic acid alkyl ester, an alkyl(meth)acrylate including an alkyl group having 1 to 14 carbon atoms suchas methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate orethylhexyl (meth)acrylate may be used. In addition, as the polymermonomer, a monomer simultaneously having a copolymer functional groupsuch as an ethylene-like double bond and a crosslinkable functionalgroup such as a hydroxyl group, a carboxyl group, an epoxy group, anisocyanate group or an amide group may be used.

A weight ratio of each monomer included in the acrylic polymer having acrosslinkable functional group is not specifically limited, and may becontrolled in consideration of initial pressure-sensitive adhesivestrength, adhesive strength and cohesive strength of a desiredpressure-sensitive adhesive layer. In addition, in the acrylic polymer,when needed, various copolymerizable monomers, as well as theabove-described monomers, may also be included in a polymerized state.The polymer may be prepared by a general polymerization method in theart, for example, solution polymerization, photo polymerization, bulkpolymerization, suspension polymerization, or emulsion polymerization.

The photocurable pressure-sensitive adhesive composition may furtherinclude a multifunctional crosslinking agent that can crosslink thepolymer with an acrylic polymer. In this case, a particular kind of thecrosslinking agent is not specifically limited, and may be, for example,a known crosslinking agent such as an isocyanate-based crosslinkingagent, an epoxy-based crosslinking agent, an aziridine-basedcrosslinking agent and a metal chelate-based crosslinking agent. Inaddition, a ratio of the crosslinking agent in the composition is notspecifically limited, and may be suitably controlled in consideration ofdesired cohesive strength.

The pressure-sensitive adhesive composition may be a photocurablepressure-sensitive adhesive composition according to one embodiment. Theterm “photocurable pressure-sensitive adhesive composition” used hereinrefers to a composition converted into a pressure-sensitive adhesive byinducing a curing process by light radiation, that is, radiation ofelectromagnetic waves. Here, the “electromagnetic waves” refer tomicrowaves, IR rays, UV rays, X rays, γ rays, or particle beams such asa particle beams, proton beams, neutron beams and electron beams, andconventionally UV rays or electron beams.

In the photocurable pressure-sensitive adhesive composition, the monomerand polymer component may include a photocurable oligomer and/or areactive monomer for dilution. As the photocurable oligomer, all kindsof oligomer components used in preparation of a photocurablepressure-sensitive adhesive composition such as a UV-curable oligomercomponent in the art may be included. For example, the oligomer may be,but is not limited to, a urethane acrylate prepared by reaction of apolyisocyanate having at least two isocyanate groups in a molecule and ahydroxyalkyl (meth)acrylate; an ester-based acrylate prepared bydehydrating condensation of a polyester polyol and (meth)acrylic acid;an ester-based urethane acrylate prepared by reaction of an ester-basedurethane resin prepared by reaction of a polyester polyol, apolyisocyanate and a hydroxyalkyl acrylate; an ester-based acrylate suchas a polyalkyleneglycol di(meth)acrylate; an ether-based urethaneacrylate prepared by reaction of an ether-based urethane resin preparedby reaction of a polyether polyol, a polyisocyanate and a hydroxyalkyl(meth)acrylate; or an epoxy acrylate prepared by an addition reaction ofan epoxy resin and (meth)acrylic acid.

As the reactive monomer for dilution, any monomer having a reactivefunctional group such as a (meth)acryloyl group in a molecular structuremay be used without particular limitation. Such a monomer may serve tocontrol a viscosity of the composition and embody pressure-sensitiveadhesive strength after curing. Such a monomer may be, but is notlimited to, an alkyl (meth)acrylate; a hydroxyl-group-containing monomersuch as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate orhydroxybutyl (meth)acrylate; a carboxylic acid-containing monomer suchas (meth)acrylic acid or beta-carboxyethyl (meth)acrylate; analkoxy-group-containing monomer such as 2-(2-ethoxyethoxyl)ethyl(meth)acrylate; an aromatic-group-containing monomer such as benzyl(meth)acrylate or phenoxyethyl (meth)acrylate; aheterocyclic-residue-containing monomer such as tetrahydrofurfuryl(meth)acrylate or (meth)acryloyl morpholine; or a multifunctionalacrylate.

Particular kinds and blending ratios of the photocurable oligomer andthe reactive monomer for dilution are not specifically limited, and maybe suitably selected in consideration of a viscosity of a desiredcomposition and a pressure-sensitive adhesive property to be embodiedafter curing.

In another example of the photocurable pressure-sensitive adhesivecomposition, the monomer or polymer component may be a photocurablesyrup. The photocurable syrup may be a monomer mixture including a(meth)acrylic acid ester monomer such as an alkyl (meth)acrylate, or apartial polymer thereof.

The (meth)acrylic acid ester included in the monomer mixture may be, forexample, an alkyl (meth)acrylate having a linear or branched alkyl grouphaving 1 to 14 carbon atoms such as methyl (meth)acrylate, ethyl(meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate,n-butyl (meth)acrylate, t-butyl (meth)acrylate, sec-butyl(meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate,2-ethylhexyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, n-octyl(meth)acrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate, lauryl(meth)acrylate or tetradecyl (meth)acrylate; a copolymerizable monomercapable of providing the above-described crosslinkable functional group;or another copolymerizable monomer, for example, the above-describedoligomer or reactive monomer for dilution.

When the pressure-sensitive adhesive composition includes a partialpolymer of the above-described monomer mixture as the syrup, apolymerizing rate of the monomer mixture or a conversion rate of themonomer is not specifically limited. For example, the polymerizing rateor conversion rate may be controlled in consideration of processefficiency or a desired pressure-sensitive adhesive property.

As another example of the photocurable pressure-sensitive adhesivecomposition, a pressure-sensitive adhesive composition capable offorming a pressure-sensitive adhesive layer including a so-calledinterpenetrating polymer network (hereinafter referred to as “IPN”) isused. The term “IPN” used herein may refer to a state in which at leasttwo crosslinked structures are present in a pressure-sensitive adhesivelayer, and in one example, the crosslinked structures may be present ina state in which they are entangled with, linked to or penetrating eachother. When the pressure-sensitive adhesive layer includes an IPN, thepressure-sensitive adhesive layer may have excellent durability underharsh conditions, and excellent workability or light leakagepreventability.

In the pressure-sensitive adhesive composition capable of forming thepressure-sensitive adhesive layer including the IPN structure, thepolymer component may be an acrylic polymer. In this case, as theacrylic polymer which can be used, an acrylic polymer used in theabove-described heat-curable pressure-sensitive adhesive compositionmaybe used. The photocurable pressure-sensitive adhesive composition mayfurther include the multifunctional crosslinking agent and thephotocurable multifunctional compound, described in the category of theheat-curable pressure-sensitive adhesive composition, in addition to theacrylic polymer. Here, the photocurable multifunctional compound maymean a compound including at least two functional groups capable ofbeing polymerized by radiation of light. The pressure-sensitive adhesivelayer formed by such a composition may include, for example, acrosslinked structure including the acrylic polymer crosslinked by themultifunctional crosslinking agent and a crosslinked structure includingthe polymerized multifunctional compound.

As the photocurable multifunctional compound, for example, amultifunctional acrylate may be used. The multifunctional acrylate maybe any compound having at least two (meth)acryloyl groups in a moleculewithout limitation. For example, the multifunctional acrylate may be abifunctional acrylate such as 1,4-butanediol di(meth)acrylate,1,6-hexanediol di(meth)acrylate, neopentylglycol di(meth)acrylate,polyethyleneglycol di(meth)acrylate, neopentylglycol adipatedi(meth)acrylate, hydroxypivalic acid neopentylglycol di(meth)acrylate,dicyclopentanyl di(meth)acrylate, caprolactone-modified dicyclopentenyldi(meth)acrylate, ethyleneoxide-modified di(meth)acrylate,di(meth)acryloxy ethyl isocyanurate, allylated cyclohexyldi(meth)acrylate, tricyclodecanedimethanol (meth)acrylate, dimethyloldicyclopentane di(meth)acrylate, ethyleneoxide-modifiedhexahydrophthalic acid di(meth)acrylate, tricyclodecanedimethanol(meth)acrylate, neopentylglycol-modified trimethylpropanedi(meth)acrylate, adamantane di(meth)acrylate, or9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorine; a trifunctional acrylatesuch as trimethylolpropane tri(meth)acrylate, dipentaerythritoltri(meth)acrylate, propionic acid-modified dipentaerythritoltri(meth)acrylate, pentaerythritol tri(meth)acrylate,propyleneoxide-modified trimethylolpropane tri(meth)acrylate,trifunctional urethane (meth)acrylate, ortris(meth)acryloxyethylisocyanurate; a tetrafunctional acrylate such asdiglycerin tetra(meth)acrylate or pentaerythritol tetra(meth)acrylate; apentafunctional acrylate such as propionic acid-modifieddipentaerythritol penta(meth)acrylate; or a hexafunctional acrylate suchas dipentaerythritol hexa(meth)acrylate, caprolactone-modifieddipentaerythritol hexa(meth)acrylate, or urethane (meth)acrylate (e.g. areaction product of an isocyanate monomer and trimethylolpropanetri(meth)acrylate). In some cases, the multifunctional acrylate may be aphotocurable oligomer known in the art, which may be any kind ofurethane acrylate, polycarbonate acrylate, polyester acrylate, polyetheracrylate or epoxy acrylate.

Ratios of the acrylic polymer, crosslinking agent and photocurablemultifunctional compound in the pressure-sensitive adhesive compositionare not specifically limited, and may be controlled by physicalproperties of a desired pressure-sensitive adhesive.

The pressure-sensitive adhesive composition may further include aradical initiator such as a photoinitiator or a thermal initiator, inaddition to the components described above, and a conventional photoradical initiator. As the photo radical initiator, any one capable ofgenerating radicals by radiation of electromagnetic waves and initiatinga curing reaction may be used without specific limitation. A ratio ofthe radical initiator is not specifically limited, either, and may beselected within a range capable of inducing a suitable curing reactionof photocurable components included in the composition.

In addition, the pressure-sensitive adhesive composition may furtherinclude at least one additive selected from the group consisting of asilane coupling agent, a pressure-sensitive adhesion providing resin, anepoxy resin, a curing agent, a UV stabilizer, an antioxidant, a coloringagent, a reinforcing agent, a filler, a foaming agent, a surfactant, anda plasticizer as needed.

A method of forming the pressure-sensitive adhesive layer using such apressure-sensitive adhesive composition is not particularly limited. Inthe process of forming the pressure-sensitive adhesive layer, a curingprocess may be performed by application of heat and/or radiation oflight, and the curing process may be performed after the packaging film300 is adhered to an adherent by the pressure-sensitive adhesive layer,that is, for example, the packaging film 300 is adhered to the displaypanel 100. In addition, the application of heat and radiation of lightare not performed under specifically limited conditions, for example,conditions capable of ensuring characteristics of the desiredpressure-sensitive adhesive layer. The radiation of light may beperformed using, for example, a means such as a high pressure mercurylamp, an electrodeless lamp or a xenon lamp. In addition, a luminescencein the radiation of light may be controlled within a range of, forexample, 50 to 2,000 mW/cm², and a quantity of light may be controlledwithin a range of 10 to 1,000 mJ/cm², but the present application is notlimited thereto.

The pressure-sensitive adhesive layer 400 is formed at least between thedisplay panel 100 and the first region 310. Here, in some cases, thepressure-sensitive adhesive layer 400 may need resistance to externalforce.

For example, under a high temperature and/or high humidity, a wave maybe generated between the first and second regions 310 and 320 of thepackaging film 300. More particularly, the first region 310 is adheredand fixed to the pressure-sensitive adhesive layer 400, and thus doesnot contract or expand, but the second region 320 may contract or expandunder a high temperature and/or high humidity. Due to such contractionand expansion of the second region 320, waves are generated between thefirst and second regions 310 and 320, and stress may be generated at anedge of the first region 310 due to the waves. Here, in some cases, aseparation phenomenon may occur between the first region 310 and thepressure-sensitive adhesive layer 400.

In addition, although this depends on the display panel 100 and thebackward diode 200, for example, when weights of the display panel 100and the backward diode 200 are large, the pressure-sensitive adhesivelayer 400 may be resistant to shearing stress. That is, thepressure-sensitive adhesive layer 400 should ensure cohesive strengthfor resisting shearing stress applied by a load of the display panel 100and the backward diode 200 not to be detached. Considering this, thepressure-sensitive adhesive layer 400 may be selected from Examples 1 to3 which will be described below.

(1) First Example of Pressure-Sensitive Adhesive Layer

According to the first example, the pressure-sensitive adhesive layer400 may have a room temperature storage modulus of 6.0×10⁵ dyn/cm² ormore. That is, the pressure-sensitive adhesive layer 400 is formed bycuring a pressure-sensitive adhesive composition, and has a storagemodulus measured at room temperature after curing of 6.0×10⁵ dyn/cm² ormore. In the present application, the room temperature storage modulusis measured by a conventional method, and may be a value measured using,for example, a dynamic viscoelasticity measuring device. The term “roomtemperature” used herein is a natural temperature that is neitherincreased nor decreased, and may differ according to a season, but maybe, for example, approximately −10 to 50° C., 5 to 40° C., 10 to 30° C.,or 15 to 25° C.

When the pressure-sensitive adhesive layer 400 has a room temperaturestorage modulus of 6.0×10⁵ dyn/cm² or more, the pressure-sensitiveadhesive layer 400 may have resistance to external force. That is, aseparation phenomenon between the first region 310 and thepressure-sensitive adhesive layer 400 may be prevented by absorbingstress caused by contraction or expansion under a high temperatureand/or high humidity. In addition, cohesive strength corresponding tothe shearing stress is also ensured, and the pressure-sensitive adhesivelayer 400 matches the first region 310. Here, when thepressure-sensitive adhesive layer 400 has a room temperature storagemodulus of less than 6.0×10⁵ dyn/cm², the pressure-sensitive adhesivelayer 400 becomes soft, and thus can absorb stress caused by contractionor expansion of the second region 320, but cohesive strength capable ofcorresponding to shearing strength caused by loads of the display panel100 and the backward diode 200 may be reduced.

Since a higher room temperature storage modulus is, the better, theupper limit is not particularly limited, but if the room temperaturestorage modulus is high, an absorbance to the stress becomes lower andthe separation may occur. Accordingly, the room temperature storagemodulus may be, for example, 1.0×10⁸ dyn/cm² or less.

In addition, in one example, the pressure-sensitive adhesive layer 400may include a pressure-sensitive adhesive resin having a weight averagemolecular weight (Mw) of 1,000,000 or more. When the pressure-sensitiveadhesive layer 400 includes a high molecular weight pressure-sensitiveadhesive resin having a weight average molecular weight (Mw) of1,000,000 or more, it is advantageous to improving cohesive strength. Toimprove the cohesive strength, that is, enhance the cohesive strengthcorresponding to shearing stress, a method of increasing a degree ofcrosslinking of a pressure-sensitive adhesive resin using a curing agentmay be considered. However, when the degree of crosslinking of thepressure-sensitive adhesive resin is increased too much using a largeamount of curing agents, although the cohesive strength is enhanced, theseparation may occur due to a low absorbance to the stress caused by thecontraction or expansion of the second region 320.

Accordingly, when a high molecular weight resin having a weight averagemolecular weight (Mw) of 1,000,000 or more is used as thepressure-sensitive adhesive resin, the cohesive strength of thepressure-sensitive adhesive layer 400 may be improved at a low degree ofcrosslinking using a small amount of a crosslinking agent. Since thepressure-sensitive adhesive resin has a higher weight average molecularweight (Mw), the upper limit is not particularly limited, but the weightaverage molecular weight (Mw) of the pressure-sensitive adhesive resinmay be, for example, 5,000,000 or less. A kind of such apressure-sensitive adhesive rein is as described above, and may beselected from, for example, acrylic polymers as exemplified above.

In addition, when a curing agent is used, that is, a pressure-sensitiveadhesive resin is included as the pressure-sensitive adhesivecomposition of the pressure-sensitive adhesive layer 400 in addition tothe curing agent, a content of the curing agent may be 0.001 to 10 partsby weight with respect to 100 parts by weight of the pressure-sensitiveadhesive resin. In addition, the pressure-sensitive adhesive resin mayhave a degree of crosslinking by the curing agent of 80% or less,preferably, for example, 2 to 80%. Here, when the content of the curingagent and the degree of crosslinking are higher than the above ranges,the absorbance to the stress is decreased, and thus the separation mayoccur. In consideration of this, the pressure-sensitive adhesive layer400 includes the pressure-sensitive adhesive resin and the curing agent,and the content of the curing agent may be 0.002 to 5 parts by weight,or 0.01 to 0.5 parts by weight with respect to 100 parts by weight ofthe pressure-sensitive adhesive resin. In addition, thepressure-sensitive adhesive resin may have a degree of crosslinking bythe curing agent of, for example, 5% to 70%, 10% to 65%, or 20% to 60%.

According to the first Example, the pressure-sensitive adhesive layer400 satisfies the room temperature storage modulus, the weight averagemolecular weight (Mw) and/or the degree of crosslinking as describedabove, and may have sufficient cohesive strength that a dislocateddistance is 1 mm or less when a vertical load of 1 kgf is applied for 4hours to an area adhered to the packaging film 300 of 25 mm×25 mm(width×length) at room temperature or 80° C. The dislocated distance ispreferably, for example, 0.001 to 1 mm.

(2) Second Example of Pressure-Sensitive Adhesive Layer

According to the second example, the pressure-sensitive adhesive layer400 may have a peeling strength (adhesive strength) of 0.8 kgf/cm to thepackaging film 300 when peeled at a peeling rate of 30 mm/min at roomtemperature.

When the pressure-sensitive adhesive layer 400 has the above-describedpeeling strength (adhesive strength), it is strongly adhered to acontact surface to the packaging film 300, and the separation due towaves caused by the contraction or expansion of the second region 320may be prevented. In addition, the pressure-sensitive adhesive layer 400and the packaging film 300 resist the shearing stress caused by loads ofthe display panel 100 and the backward diode 200, and thus aredislocated.

In the present application, the peeling strength (adhesive strength) ismeasured by a conventional method of measuring peeling strength used inthe field of pressure-sensitive adhesives, and may be a value measuredat a peeling strength of, for example, 180 degrees. The upper limit ofthe peeling strength (adhesive strength) is not particularly limited,and may be, for example, less than or equal to 5.0 kgf/cm. Meanwhile,the pressure-sensitive adhesive layer 400 may have a room temperaturestorage modulus of 6.0×10⁵ dyn/cm² or less with the peeling strength asdescribed above.

In addition, in one example, the pressure-sensitive adhesive layer 400includes an acrylic copolymer as a pressure-sensitive adhesive resin,and may have a weight average molecular weight (Mw) of 1,000,000 or morefor the above-described reason. Here, the acrylic copolymer may containa crosslinked monomer at 0.1 to 10 parts by weight with respect to 90 to99.9 parts by weight of a (meth)acrylic acid ester-based monomer havingan alkyl group.

A particular kind of the (meth)acrylic acid ester-based monomercontained in the acrylic copolymer is not specifically limited. Here,when the alkyl group contained herein becomes too long, there is concernof it is apprehended that the cohesive strength decreasing. Thus, it ispreferable that a monomer having an alkyl group having 1 to 12 carbonatoms be used to maintain cohesive strength under a high temperatureand/or high humidity. Such a monomer may be at least one selected fromthe group consisting of methyl (meth)acrylate, ethyl (meth)acrylate,n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl(meth)acrylate, t-butyl (meth)acrylate, sec-butyl (meth)acrylate, pentyl(meth)acrylate, 2-ethylbutyl (meth)acrylate, 2-ethylhexyl(meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate andisononyl (meth)acrylate.

In addition, the (meth)acrylic acid ester-based monomer is included at90 to 99.9 parts by weight with respect to the acrylic copolymer. Here,when the content of the (meth)acrylic acid ester-based monomer is lessthan 90 parts by weight, initial adhesive strength of thepressure-sensitive adhesive may be degraded, and when the content of the(meth)acrylic acid ester-based monomer is more than 99.9 parts byweight, cohesive strength may be decreased.

In addition, the crosslinked monomer contained in the acrylic copolymeris not particularly limited as long as it contains a crosslinkablefunctional group, and may be at least one selected from the groupconsisting of a hydroxyl group-containing monomer, a carboxylgroup-containing monomer and a nitrogen-containing monomer. Such acrosslinked monomer is reacted with a crosslinking agent to form acrosslinked structure, and thus cohesive strength and adhesive strengthmay be provided to prevent breakage of the cohesive strength of thepressure-sensitive adhesive under a high temperature and/or highhumidity.

As the crosslinked monomer, the hydroxyl group-containing monomer may beat least one selected from 2-hydroxyethyl (meth)acrylate,2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate,6-hydroxyhexyl (meth)acrylate, 2-hydroxyethyleneglycol (meth)acrylateand 2-hydroxypropyleneglycol (meth)acrylate, the carboxylgroup-containing monomer may be at least one selected from (meth)acrylicacid, an acrylic acid dimer, itaconic acid, maleic acid, maleic acidanhydride and fumaric acid, or the nitrogen-containing monomer may be atleast one selected from acryl amide, N-vinylpyrrolidone and N-vinylcaprolactone.

The crosslinked monomer may be included at 0.1 to 10 parts by weight inthe acrylic copolymer. Here, when the content of the crosslinked monomeris less than 0.1 parts by weight, breakage of cohesion may occur under ahigh temperature and/or a high temperature and humidity, and when thecontent is more than 10 parts by weight, a surface transfer phenomenonmay occur due to a decrease in compatibility, a flowing characteristicmay be decreased and/or stress relaxation may be degraded due to anincrease in cohesive strength.

In addition, the acrylic copolymer may further contain a copolymerizablemonomer. The copolymerizable monomer may be added to control a glasstransition temperature and provide other functionalities. Such acopolymerizable monomer may be, but is not limited to, at least oneselected from acrylonitrile, a nitrogen-containing monomer such as(meth)acrylamide, N-methyl (meth)acrylamide and/or N-butoxy methyl(meth)acrylamide; a styrene-based monomer such as styrene and/or methylstyrene; glycidyl (meth)acrylate; and vinyl acetate.

Here, the copolymerizable monomer may be contained at 40 parts by weightwith respect to 90 to 99.9 parts by weight of the (meth)acrylic acidester-based monomer. When the content of the copolymerizable monomer ismore than 40 parts by weight, flexibility and/or peeling strength of thepressure-sensitive adhesive composition may be degraded.

According to a more particular exemplary embodiment, thepressure-sensitive adhesive layer 400 includes an acrylic copolymer as apressure-sensitive adhesive resin. The acrylic copolymer may contain 5to 40 parts by weight of methyl (meth)acrylate, 5 to 40 parts by weightof a copolymerizable monomer, and 0.1 to 1.0 parts by weight of acrosslinked monomer with respect to 50 to 99 parts by weight of a(meth)acrylic monomer having an alkyl group having 4 to 12 carbon atoms.Kinds of the components constituting such an acrylic copolymer aredescribed above. When the acrylic copolymer composed as described aboveis included, it is preferable to improving physical properties such aspeeling strength (adhesive strength) and/or a room temperature storagemodulus.

In addition, the pressure-sensitive adhesive composition for thepressure-sensitive adhesive layer 400 may further include 0.01 to 10parts by weight of a crosslinking agent with respect to 100 parts byweight of the acrylic copolymer, in addition to the acrylic copolymer asdescribed above. The crosslinking agent is reacted with a crosslinkedmonomer included in the acrylic copolymer to serve to control apressure-sensitive adhesive characteristic of the pressure-sensitiveadhesive composition and enhance cohesive strength. A particular kind ofthe crosslinking agent is not specifically limited, and may be anisocyanate-based compound, an epoxy-based compound, an aziridine-basedcompound and/or a metal chelate-based compound as described above.

Here, the isocyanate-based compound may be at least one selected fromthe group consisting of tolylene diisocyanate, xylene diisocyanate,diphenylmethane diisocyanate, hexamethylene diisocyanate, isoborondiisocyanate, tetramethylxylene diisocyanate or naphthalenediisocyanate, and in some cases, a reaction product of at least one ofthe isocyanate compounds described above and a polyol (e.g., trimethylolpropane) may be used. In addition, the epoxy-based compound may be atleast one selected from the group consisting of ethyleneglycoldiglycidylether, triglycidylether, trimethylolpropane triglycidylether,N,N,N′,N′-tetraglycidyl ethylenediamine and glycerine diglycidylether,the aziridine-based compound may be at least one selected from the groupconsisting of N,N′-toluene-2,4-bis(1-aziridinecarboxide),N,N′-diphenylmethane-4,4′-bis(1-aziridinecarboxide), triethylenemelamine, bisisoprotaloyl-1-(2-methylaziridine) andtri-1-aziridinylphosphineoxide, and the metal chelate-based compound maybe a compound in which a polyvalent metal such as aluminum, iron, zinc,tin, titanium, antimony, magnesium and/or vanadium is coordinated withacetyl acetone or ethyl acetoacetate, but the present application is notlimited thereto.

Moreover, the pressure-sensitive adhesive composition for thepressure-sensitive adhesive layer 400 may further include apressure-sensitive adhesion-providing resin at 1 to 100 parts by weightwith respect to 100 parts by weight of the acrylic copolymer to controlpressure-sensitive adhesive performance. A kind of such apressure-sensitive-adhesion-providing resin is not specifically limited,and may be, for example, at least one selected from a (hydrogenated)hydrocarbon-based resin, a (hydrogenated) rosin resin, a (hydrogenated)rosin ester resin, a (hydrogenated) terpene resin, a (hydrogenated)terpene phenol resin, a polymerized rosin resin, and a polymerized rosinester resin. Here, when the content of the pressure-sensitiveadhesion-providing resin is less than 1 part by weight, an additioneffect may be insignificant, and when the content is more than 100 partsby weight, compatibility and/or cohesive strength-enhancing effects areprobably degraded.

In addition, the pressure-sensitive adhesive composition for thepressure-sensitive adhesive layer 400 may further include a silanecoupling agent at 0.005 to 5 parts by weight with respect to 100 partsby weight of the acrylic copolymer. The silane coupling agent may serveto improve thermal resistance and moisture resistance by increasingadhesive stability, and enhance adhesive reliability when maintained fora long time under a high temperature and/or high humidity. A kind of thesilane coupling agent is not specifically limited, and may be, forexample, at least one selected from γ-glycidoxypropyltrimethoxy silane,γ-glycidoxypropylmethyldiethoxy silane, γ-glycidoxypropyltriethoxysilane, 3-mercaptopropyltrimethoxy silane, vinyltrimethoxy silane,vinyltriethoxy silane, γ-methacryloxypropyltrimethoxy silane,γ-methacryloxypropyltrimethoxy silane, γ-methacryloxypropyltriethoxysilane, γ-aminopropyltrimethoxy silane, γ-aminopropyltriethoxy silane,3-isocyanatopropyltriethoxy silane, and γ-acetoacetatepropyltrimethoxysilane. Here, when a content of the silane coupling agent is less than0.005 parts by weight, the addition effect may be insignificant, andwhen a content of the silane coupling agent is more than 5 parts byweight, durability and reliability may be degraded due to a bubbling orpeeling phenomenon.

In addition, the pressure-sensitive adhesive composition for thepressure-sensitive adhesive layer 400 may further include a curingagent. Here, when a pressure-sensitive adhesive resin (e.g., an acryliccopolymer) and a curing agent are included as the pressure-sensitiveadhesive composition for the pressure-sensitive adhesive layer 400, acontent of the curing agent may be 0.001 to 10 parts by weight withrespect to 100 parts by weight of the pressure-sensitive adhesive resin.When the content of the curing agent is less than 0.001 parts by weight,a cohesive-strength-improving effect of the pressure-sensitive adhesivelayer 400 according to the addition of the curing agent may beinsignificant, and when the content of the curing agent is more than 10parts by weight, separation may occur due to low absorbance to a stress.In consideration of this, the pressure-sensitive adhesive layer 400includes a pressure-sensitive adhesive resin and a curing agent, and acontent of the curing agent may be 0.002 to 5 parts by weight or 0.01 to0.5 parts by weight with respect to 100 parts by weight of thepressure-sensitive adhesive resin.

According to the second example, the pressure-sensitive adhesive layer400 satisfies the peeling strength (adhesive strength), the roomtemperature storage modulus, the weight average molecular weight (Mw)and/or the degree of crosslinking as described above, and may havesufficient cohesive strength that a dislocated distance is 0.5 mm orless when a vertical load of 1 kgf is applied for 4 hours to an adhesivearea to the packaging film 300 of 25 mm×25 mm at room temperature or 80°C. Preferably, the dislocated distance is, for example, 0.001 to 0.5 mm.

(3) Third Example of Pressure-Sensitive Adhesive Layer

According to the third example, the pressure-sensitive adhesive layer400 includes a photocurable pressure-sensitive adhesive composition, andpreferably has a room temperature storage modulus after photocuring of1.0×10⁶ dyn/cm² or more. That is, the pressure-sensitive adhesive layer400 is formed by curing a photocurable pressure-sensitive adhesivecomposition, and has a storage modulus measured at room temperatureafter photocuring of 1.0×10⁶ dyn/cm² or more.

When the pressure-sensitive adhesive layer 400 has a room temperaturestorage modulus of 1.0×10⁶ dyn/cm² or more, resistance to external forcemay be ensured. That is, the separation phenomenon between the firstregion 310 and the pressure-sensitive adhesive layer 400 may beprevented by absorbing stress caused by contraction or expansion under ahigh temperature and/or high humidity. In addition, cohesive strengthcorresponding to the shearing stress is ensured, thereby preventingdislocation. Here, when the pressure-sensitive adhesive layer 400 has aroom temperature storage modulus of less than 1.0×10⁶ dyn/cm², thepressure-sensitive adhesive layer 400 becomes soft, and may absorbstress caused by the contraction or expansion of the second region 320,but cohesive strength corresponding to shearing stress caused by theloads of the display panel 100 and the backward diode 200 may bereduced.

Since a higher room temperature storage modulus is better, the upperlimit is not specifically limited, but when the room temperature storagemodulus is too high, in some cases, the absorbance to stress isdecreased, and thus the separation may occur. Accordingly, the roomtemperature storage modulus may be, for example, 1.0×10⁸ dyn/cm² orless.

In addition, in one example, the pressure-sensitive adhesive layer 400may include a pressure-sensitive adhesive resin having a weight averagemolecular weight (Mw) of 1,000,000 or more for the above-describedreason. A kind of the pressure-sensitive adhesive resin is as describedabove, and may be selected from, for example, the photocurable acryliccopolymers as described above.

According to exemplary examples, the pressure-sensitive adhesive layer400 may be formed of a photocurable pressure-sensitive adhesivecomposition including an acryl copolymer, a photocurable multifunctionalacrylate, and a curing agent. In addition, as needed, thepressure-sensitive adhesive layer 400 may further include aphotoinitiator. Kinds of components constituting such a photocurablepressure-sensitive adhesive composition are described above. When thedisplay panel 100 is adhered to the backward diode 200 using such aphotocurable pressure-sensitive adhesive composition, and UV radiationis performed thereon, a multifunctional acrylate is cured, and thus astrong adhesive characteristic may be ensured.

According to a more particular example, the pressure-sensitive adhesivelayer 400 may include 2 to 30 parts by weight of a photocurablemultifunctional acrylate and 0.001 to 10 parts by weight of a curingagent with respect to 100 parts by weight of an acryl copolymer. Inaddition, as needed, the pressure-sensitive adhesive layer 400 mayfurther include 0.001 to 10 parts by weight of a photoinitiator withrespect to 100 parts by weight of the acrylic copolymer.

According to the third example, the pressure-sensitive adhesive layer400 satisfies the room temperature storage modulus, the weight averagemolecular weight (Mw) and/or the degree of crosslinking as describedabove, and may have sufficient cohesive strength that a dislocateddistance is 0.2 mm or less when a vertical load of 1 kgf is applied for4 hours to an area adhered to the packaging film 300 of 25 mm×25 mm(width×length) at room temperature or 80° C.

In addition, referring to FIGS. 2 to 4, according to the thirteenthembodiment of the present application, a barrier layer 500 may be formedon a side surface of the display panel 100.

The barrier layer 500 may prevent penetration of at least externalmoisture into the display panel 100. To this end, the barrier layer 500may have at least moisture impermeability (moisture blockage). Inaddition, the barrier layer 500 may prevent the penetration of a gassuch as external air, in addition to, moisture, and to this end, thebarrier layer 500 may have impermeability to a gas such as air, inaddition to the moisture blockage.

In the present application, the barrier layer 500 is not specificallylimited as long as it has at least moisture blockage. The barrier layer500 may include at least one selected from, for example, amoisture-blocking resin layer, a metal thin film and a deposition layer.

The moisture-blocking resin layer may be a film layer formed by adheringa moisture-blocking resin film to the display panel 100, or a resincoating layer formed by coating a moisture-blocking resin composition toa side surface of the display panel 100. The resin compositionconstituting such a moisture-blocking resin layer is not limited, andincludes heat-curable and photocurable compositions. In addition, themoisture-blocking resin layer may have, for example, a structure of oneor at least two layer.

The moisture-blocking resin layer may include, for example, astyrene-based resin, a polyolefin-based resin, a thermoplasticelastomer, a polyoxyalkylene-based resin, a polyester-based resin, apolyvinyl chloride-based resin, a PC-based resin, apolyphenylenesulfide-based resin, a mixture of hydrocarbons, apolyamide-based resin, an acrylate-based resin, an epoxy-based resin, asilicon-based resin, a fluorine-based resin and/or a mixture thereof.

The styrene-based resin may be, for example, astyrene-ethylene-butadiene-styrene (SEBS) block copolymer, astyrene-isoprene-styrene (SIS) block copolymer, anacrylonitrile-butadiene-styrene (ABS) block copolymer, anacrylonitrile-styrene-acrylate (ASA) block copolymer, astyrene-butadiene-styrene (SBS) block copolymer, a styrene-basedhomopolymer, and/or a mixture thereof. The olefin-based resin may be,for example, a high-density PE-based resin, a low-density PE-basedresin, a PP-based resin and/or a mixture thereof. The thermoplasticelastomer may include, for example, an ester-based thermoplasticelastomer, an olefin-based thermoplastic elastomer and/or a mixturethereof. Among these, as the olefin-based thermoplastic elastomer, apolybutadiene resin and/or a polyisobutene resin may be used. Thepolyoxyalkylene-based resin may be, for example, apolyoxymethylene-based resin, a polyoxyethylene-based resin and/or amixture thereof. The polyester-based resin may be, for example, apolyethylene terephthalate-based resin, a polybutyleneterephthalate-based resin and/or a mixture thereof. Thepolyvinylchloride-based resin may be, for example, polyvinylidenechloride. The mixture of the hydrocarbon may be, for example,hexatriacontane and/or paraffin. The polyamide-based resin may be, forexample, nylon. The acrylate-based resin may be, for example,polybutyl(meth)acrylate. The epoxy-based resin may be, for example, abisphenol type such as a bisphenol A-, bisphenol F-, or bisphenol S-typeepoxy-based resin or a hydrogenated product thereof; a novolac type suchas a phenolnovolac- or cresolnovolac-type epoxy-based resin; anitrogen-containing cyclic type such as a cyclictriglycidylisocyanurate- or hydantoin-type epoxy-based resin; analicyclic type; an aliphatic type; an aromatic type such as anaphthalene-type epoxy-based resin or a biphenyl-type epoxy-based resin;a glycidyl type such as a glycidylether-type epoxy-based resin, aglycidylamine-type epoxy-based resin, or a glycidylester-typeepoxy-based resin; a dicyclo type such as a dicyclopentadiene-typeepoxy-based resin; an ester type; an etherester type; or a mixturethereof. The silicon-based resin may be, for example, apolydimethylsiloxane. In addition, the fluorine-based resin may be apolytrifluoroethylene resin, a polytetrafluoroethylene resin, apolychlorotrifluoroethylene resin, a polyhexafluoropropylene resin, apolyvinylidene fluoride, a polyvinyl fluoride, a polyethylene propylenefluoride and/or a mixture thereof.

The resin listed as a component of the moisture-blocking resin layer maybe grafted with maleic acid anhydride, copolymerized with another resinlisted above or a monomer for preparing a resin, or modified by anothercompound, which may be a carboxyl-terminated butadiene-acrylonitrilecopolymer.

In addition, the resin listed as the moisture-blocking resin layer mayinclude at least one heat-curable functional group or site such as aglycidyl, isocyanate, hydroxyl, carboxyl, or amide group, or at leastone active energy ray-curable functional group or site such as anepoxide, cyclic ether, sulfide, acetal or lactone group to exhibit anadhesive property after curing.

In one example, the moisture-blocking resin layer may include apolyisobutene resin. The polyisobutene resin may exhibit a low watervapor transmission rate (WVTR) and surface energy due to hydrophobicity.Particularly, the polyisobutene resin may be, for example, a homopolymerof an isobutylene monomer; and/or a copolymer prepared by copolymerizinganother monomer which can be polymerized with an isobutylene monomer.Here, the monomer which can be polymerized with an isobutylene monomermay be, for example, 1-butene, 2-butene, isoprene or butadiene.

In addition, as a component of the moisture-blocking resin layer, a baseresin having a weight average molecular weight (Mw) at which it can bemolded in a film type may be used. According to an exemplary embodiment,the range of the weight average molecular weight (Mw) at which the baseresin can be molded in a film type may be approximately 100,000 to2,000,000, 100,000 to 1,500,000 or 100,000 to 1,000,000.

According to another exemplary embodiment, the moisture-blocking resinlayer may further include a moisture remover, in addition to theabove-described resin component. Accordingly, the moisture blockage ofthe moisture-blocking resin layer may be further enhanced. For example,the moisture remover may be uniformly dispersed in the resin layer.Here, the uniformly dispersed state may be a state in which a moistureremover is present at the same or substantially the same density in allparts of the moisture-blocking resin layer.

The moisture remover may be, for example, a metal oxide, a sulfate or anorganic metal oxide. Here, although not specifically limited, the metaloxide may be magnesium oxide, calcium oxide, strontium oxide, bariumoxide or aluminum oxide, the sulfate may be magnesium sulfoxide, sodiumsulfoxide or nickel sulfoxide, and the organic metal oxide may bealuminum oxide octylate.

The moisture remover may use one of the above-described components, orat least two thereof. In addition, when at least two components are usedas the moisture remover, for example, calcined dolomite may be used.

Such a moisture remover may have a suitable size. In one example, anaverage particle diameter of the moisture remover may be controlled toapproximately 10 to 15,000 nm. The moisture remover having the aboverange of size may effectively block moisture. A content of the moistureremover may be, for example, 5 to 250 parts by weight with respect to100 parts by weight of the resin capable of being used asmoisture-blocking resin layer described above.

In addition, the moisture-blocking resin layer may further include adispersing agent such that the moisture remover is uniformly dispersedin the resin layer. As the dispersing agent capable of being usedherein, for example, a non-ionic surfactant having an affinity to ahydrophilic surface of the moisture remover and a compatibility with theresin may be used. According to another exemplary embodiment, when themoisture-blocking resin layer has moisture preventability, heat-curableand photocurable pressure-sensitive adhesive composition as describedwith regard to the pressure-sensitive adhesive layer 400 may beincluded.

Metal foil having a thickness of 1 to 300 μm may be used as the metalthin film, and for example, a barrier layer 500 may be formed byadhering the metal thin film to the display panel 100 using an adhesive.

In addition, the deposition layer is formed by depositing at least oneselected from metals and metal oxides, and may be deposited on a basefilm, for example, PET, PE or PP, and adhered to the display panel 100with the base film, thereby forming a barrier layer 500.

In the present application, a metal applied as the barrier layer 500,particularly, a metal constituting the metal thin film or depositionlayer may be, but is not limited to, at least one selected from thegroup consisting of aluminum (Al), copper (Cu), nickel (Ni), tin (Sn),zinc (Zn), indium (In), silver (Ag), tungsten (W) and iron (Fe), or analloy of at least two thereof. In addition, the metal oxide capable ofbeing used as the deposition layer may be selected from, for example,aluminum oxide (Al₂O₃), silicon oxide (SiO₂), tin oxide (SnO₂), indiumoxide (In₂O₃) and zinc oxide (ZnO).

In addition, the barrier layer 500 includes the above-describedmoisture-blocking resin layer, which may be formed by coating aheat-curable and photocurable resin composition (pressure-sensitiveadhesive composition), and have a peeling strength (pressure-sensitiveadhesive strength) of 2.5 kgf/inch or more. The upper limit of thepeeling strength is not limited. When the composition has such peelingstrength, for example, binding strength to the multi-layer structuredisplay panel 100 may be reinforced. Particularly, as themoisture-blocking resin layer is also pressure-sensitivly adhered andfixed to side surfaces of a liquid crystal cell layer 120, an upperpolarizing plate 140 and a lower polarizing plate 160, the bindingstrength between the layers of the display panel 100 may be reinforced.Particularly, a peeling strength of the moisture-blocking resin layermay be 2.5 or 20.0 kgf/inch.

According to the thirteenth embodiment of the present application, thepackaging film 300 according to the present application may furtherinclude the pressure-sensitive adhesive layer as described above as apart of the components. According to an example, the packaging film 300of the present application may have a structure in which thepressure-sensitive adhesive layer 400 as described above may be furtherformed in at least a first region 310. In addition, a releasing papermay be stacked on the pressure-sensitive adhesive layer 400. Accordingto another example, the packaging film 300 of the present applicationmay have a structure in which a pressure-sensitive adhesive layer thatprovides an adhesive strength to the backward diode 200, that is, thesecond pressure-sensitive adhesive layer as described above, is furtherformed on at least one selected from the second region 320 and the thirdregion 330. Moreover, the releasing paper may be stacked on the secondpressure-sensitive adhesive layer.

In addition, according to another embodiment of the present application,the packaging film 300 of the present application may have a structurein which a protective film is formed on the first region 310, and thepressure-sensitive adhesive layer 400 is formed on the protective film.In addition, a releasing paper may be adhered to the pressure-sensitiveadhesive layer 400. Here, the protective film may be selected from resinfilms, for example, films including TAC and/or an acrylic resin. Such aprotective film may have adhesive strength to the first region 310through a pressure-sensitive adhesive. The releasing paper is notspecifically limited, as long as it can protect the pressure-sensitiveadhesive layer 400, and thus, for example, a resin film or paper havingreleasability may be used.

According to the first example of the present application describedabove, an improved display device is embodied. For example, when thebackward diode 200 of the optical diode 200A is packaged by thepackaging film 300, and adhered to a bottom surface of the display panel100 through the pressure-sensitive adhesive layer 400, a bezel regionbecomes minimized. That is, as the use of a molding frame to fix thedisplay panel 100 with the backward diode 200 is excluded, a bezel-freedisplay device in which almost no bezel is included may be embodied.

In addition, the backward diode 200, for example, does not consume toomuch time or cause damage to the optical diode 200A, which can occur inhandling and assembly of the optical diode 200A on a film (or sheet). Inaddition, the optical diode 200A is packaged by the packaging film 300to have sealability, and thus a light leakage phenomenon is prevented.

Second Embodiment

Hereinafter, a packaging film 300′ according to a second embodiment ofthe present application will be explained.

In FIGS. 10 to 17, examples of the packaging film 300′ according to thesecond embodiment of the present application are shown. To explain thesecond embodiment of the present application, the same terms andreference marks as in the first embodiment exhibit the same functions,and thus detailed description thereof will be omitted. Hereinafter, anypart that is not specifically explained is the same as in the firstembodiment. For example, this applies to materials and physicalproperties of the packaging film 300′. In addition, in some cases, thefirst embodiment may include a configuration of the second embodimentwhich will be explained below.

The packaging film 300′ surrounds and packages a top surface 101 and aside surface 102 of a display panel 100. In addition, the packaging film300′ surrounds and packages at least a side surface 202 of a backwarddiode 200. To this end, the packaging film 300′ includes a first region310 corresponding to the top surface 101 of the display panel 100 and asecond region 320 corresponding to the side surface 102 of the displaypanel 100 and a side surface 202 of the backward diode 200. The secondregion 320 extends from the first region 310.

The display device includes the packaging film 300′ of the presentapplication as described above. The display device includes the displaypanel 100 according to an exemplary example, the backward diode 200equipped on a bottom surface of the display panel 100, and the packagingfilm 300′ packaging the display panel 100 and the backward diode 200.

Hereinafter, in the description of the exemplary embodiment of thesecond embodiment, the packaging film 300′ of the present application isalso described by describing the display device.

The display panel 100 and the backward diode 200 are the same asdescribed in the first embodiment. The display panel 100 may be any onecapable of displaying an image as described in the first embodiment.

FIGS. 10 to 12 are exemplary examples of the display panel 100. FIGS. 10to 12 particularly show a liquid crystal display (LCD) panel.

Referring to FIGS. 10 to 12, the display panel 100 may include, forexample, at least one liquid crystal cell layer 120, and a top surfacepolarizing plate 140 formed on the liquid crystal cell layer 120 and abottom surface polarizing plate 160 formed under the liquid crystal celllayer 120 as polarizing plates formed on both surfaces of the liquidcrystal cell layer 120.

The backward diode 200 is not particularly limited, as long as it isequipped on the bottom surface of the display panel 100 as described inthe first embodiment. The backward diode 200 may be composed of onemember, or a multi-layer structure including at least two members. Thebackward diode 200 may have, for example, a film, sheet, plane, and/orthree-dimensional shape. Particularly, the backward diode 200 mayinclude at least one selected from an electric/electronic diode havingan electric/electronic function, an optical diode having an opticalfunction, and/or a heat dissipation diode having a heat dissipatingfunction.

FIG. 10 shows a backward diode 200 composed of one member. Here, thebackward diode 200 shown in FIG. 10 may be selected from, for example,an optical diode 200A, an electronic circuit board, and a heatdissipation plate. Particularly, for example, the backward diode 200 maybe selected from the optical diode 200A.

The optical diode 200A may be a diode having, for example, lightdiffusing, concentrating, polarizing and/or reflecting function(s), butthe present application is not limited thereto. In addition, the opticaldiode 200A may include a light source generating light. In the presentapplication, the optical diode 200A includes a light source generatinglight, and all kinds of devices, films and/or sheets used to treatlight. The optical diode 200A may include at least one optical member200 a selected from, for example, a light guide plate, a diffuser sheet,a brightness enhancement film, a prism film, a lens film, a polarizingfilm, a reflective film, a viewing angle compensation film, aretardation film and a protective film for protecting it.

In addition, the optical diode 200A may be selected from a light sourceassembly further including a light source 240 in the optical member 200a as described above. In the present application, a particularembodiment of the light source assembly is not specifically limited, andmay be selected from, for example, conventional direct-type andedge-type light source assemblies. Particularly, the light sourceassembly serving as the optical diode 200A may be selected from a BLUconventionally used in an LCD device.

FIGS. 11 and 12 show backward diodes 200, which are multi-layer opticaldiodes 200A. Particularly, as the backward diode 200, FIG. 11 is anoptical diode 200A including a plurality of optical members 200 a, andFIG. 12 is an optical diode 200A including a plurality of opticalmembers 200 a and a light source 240.

Referring to FIG. 11, the optical diode 200A may include a light guideplate 210 converting a point light source emitted from a light sourceinto a surface light source, and a diffuser sheet 220 formed on thelight guide plate 210 and diffusing light generated from the light guideplate 210 optical members 200 a. In addition, the optical diode 200A mayfurther include a brightness enhancement film 230 formed on the diffusersheet 220. Furthermore, such optical members 200 a may be formed in oneor at least two layers. In FIG. 11, a brightness enhancement film 230having a bilayer structure is shown. Such an optical diode 200A is, asshown in FIG. 11, packaged by the packaging film 300′ and equipped on abottom surface of the display panel 100. Here, in FIG. 11, a lightsource providing light to the light guide plate 210 is not shown, butthe light source may be separately equipped outside to provide light tothe light guide plate 210.

In addition, referring to FIG. 12, the optical diode 200A may bepackaged by a packaging film 300′ with the display panel 100, after aplurality of optical members 200 a and a light source 240 are formed inan assembly. Particularly, the optical diode 200A is a light sourceassembly including the light source 240, which may include at least onelight source 240, a light guide plate 210 formed on the light source 240and converting a point light source emitted from the light source 240into a surface light source, and a diffuser sheet 220 formed on thelight guide plate 210 and diffusing light emitted from the light guideplate 210. In addition, as shown in FIG. 12, the optical diode 200A mayfurther include a brightness enhancement film 230 formed on the diffusersheet 220.

The packaging film 300′ packages the display panel 100 and the backwarddiode 200 described above. Here, as the backward diode 200, when theoptical diode 200A is packaged, the light source 240 may not be packagedby the packaging film 300′ as shown in FIG. 11, or may be packaged alongwith the optical member 200 a as shown in FIG. 12.

The packaging film 300′ includes a first region 310, and a second region320 extending from the first region 310. The first region 310corresponds to a top surface 101 of the display panel 100. In addition,the second region 320 corresponds to a side surface 102 of the displaypanel 100 and a side surface 202 of the backward diode 200. Referring toFIG. 12, the second region 320 includes a first flap 321 extending fromthe first region 310 and a second flap 322 extending from the first flap321. In addition, the first flap 321 corresponds to the side surface 102of the display panel 100, and the second flap 322 corresponds to theside surface 202 of the backward diode 200.

The packaging film 300′ further includes, preferably, a third region 330providing strong fixing strength between the display panel 100 and thebackward diode 200. The third region 330 extends from the second region320, and corresponds to a bottom surface 203 of the backward diode 200.

In FIGS. 13 to 17, exemplary examples of the packaging film 300′ areshown.

At least the first region 310 and the second region 320 of the regions310, 320 and 330 of the packaging film 300′ may have areas equal orsimilar to the parts corresponding thereto. For example, the area of thefirst region 310 may be equal or similar to that of the top surface 101of the display panel 100. In addition, the area of the second region 220may be equal or similar to the sum of the area of the side surface 102of the display panel 100 and the area of the side surface 202 of thebackward diode 200. More particularly, an area of the first flap 321 maybe equal or similar to the area of the side surface 102 of the displaypanel 100, and an area of the second flap 322 may be equal or similar tothe area of the side surface 202 of the backward diode 200.

In addition, at least two of the second regions 320 may be included. Forexample, two to four second regions 320 may be included. That is, thesecond region 320 extends from the first region 310, and may be at leasttwo of the four surfaces of the first region 310. In addition, forexample, there may be two to four third regions 330, which may be thesame as the number of the second regions 320. For example, in FIG. 13,there are three second regions 320, and there are also three thirdregions 330.

The packaging film 300′ is not limited as long as it includes the firstregion 310 and the second region 320 as shown above, and preferablyfurther includes the third region 330. In addition, the regions 310, 320and 330 may be formed in one process. The packaging film 300′ may beformed in one process without a joint between the regions 310, 320 and330 by, for example, cutting one film to have the regions 310, 320 and330 as shown above.

A material of the packaging film 300′ is the same as that used in thepackaging film 300 according to the first embodiment. The packaging film300′ may be selected from transparent films. The packaging film 300′ mayhave optical properties including polarization, concentration and/ordiffusion of light when needed. At least the first region 310 may havesuch optical properties. In this case, it can be useful to package theoptical diode 200A.

In addition, the packaging film 300′ may be selected from isotropicfilms. In the present application, the isotropy is such that the filmhas little to no retardation, to the extent that no substantialinfluence is exerted on a phase of light penetrating through the film.

The packaging film 300′ may have an in-plane retardation (R_(in)) of,for example, 30 nm or less. The packaging film 300′ may have an in-planeretardation (R_(in)) calculated by Equation 1 of 30 nm or less, 25 nm orless, or 10 nm or less, and preferably, for example, approximately 0 to25 nm, 0 to 10 nm, 0.1 to 5 nm, 0.2 to 3 nm, or 0.5 to 2 nm.

In addition, the packaging film 300′ may have a thickness-directionretardation (R_(th)) of 35 nm or less. The packaging film 300′ may havea thickness-direction retardation (R_(th)) calculated by Equation 2 of,for example, 35 nm or less, 30 nm or less, 20 nm or less, or 10 nm orless, and preferably, for example, 0 to 30 nm, 0 to 20 nm, 0 to 10 nm,0.1 to 5 nm, or 0.2 to 3 nm.

In the packaging of the display panel 100 and the backward diode 200,the regions 310, 320 and 330 of the packaging film 300′ are bent onboundary lines C1 and C2. In the drawings, the boundary lines C1 and C2between the regions 310, 320 and 330 are shown by dotted lines. Here,the boundary lines C1 and C2 are represented for convenience ofdescription, and may or may not actually visible on the packaging film300′.

To package the display panel 100 and the backward diode 200 using thepackaging film 300′, for example, first, the first region 30 is locatedto correspond to the top surface 101 of the display panel 100, and onthe first boundary line C1, the second region 320 is bent, and then thesecond region 320 is located to correspond to the side surface 102 ofthe display panel 100 and the side surface 202 of the backward diode200. In addition, when the third region 330 is further included, on thesecond boundary line (C2), the third region 330 is bent, and then thethird region 330 is located to correspond to the bottom surface 203 ofthe backward diode 200 for packaging.

According to an exemplary embodiment, the packaging film 300′ may haveadhesive strength between the display panel 100 and the backward diode200. The adhesive strength may be generated, for example, at a contactinterface between the display panel 100 and the backward diode 200. Theadhering method may be performed by, for example, applying thermaland/or photo laminating method(s) without specific limitation. Forexample, the display panel 100 and the backward diode 200 may be adheredby applying heat or radiating light to the packaging film 300′ forfusion. In the adhesion through such a laminating method, conditions forradiating heat and light may be suitably selected according to a kind ofthe packaging film 300′ without specific limitation.

The packaging film 300′ may have adhesive strength by being fused withthe display panel 100 and the backward diode 200, for example, in atleast one selected from the second region 320 and the third region 330.

According to another exemplary embodiment, the packaging film 300′ mayhave adhesive strength to the display panel 100 and the backward diode200 by a separate adhesive means. The adhesive means may be apressure-sensitive adhesive layer (not shown) formed, for example,between the packaging film 300′ and the display panel 100, and/orbetween the packaging film 100 and the backward diode 200.

The pressure-sensitive adhesive layer is preferably formed at a contactinterface between the packaging film 300′ and the display panel 100,and/or at a contact interface between the packaging film 300′ and thebackward diode 200, thereby providing binding strength therebetween.Such a pressure-sensitive adhesive layer may be coated on the packagingfilm 300′, or coated on the display panel 100 and the backward diode200.

For example, the pressure-sensitive adhesive layer may be formed in atleast one selected from the second region 320 and the third region 330.Particularly, the pressure-sensitive adhesive layer may be formed oninner surfaces of at least the second region 320 and/or the third region330 among the regions 310, 320 and 330 of the packaging film 300′, thatis, on a surface in contact with the display panel 100 and the backwarddiode 200.

The pressure-sensitive adhesive layer is not specifically limited, aslong as it has adhesive strength (pressure-sensitive adhesive strength),and may be formed by, for example, coating a pressure-sensitive adhesivecomposition. The pressure-sensitive adhesive composition may be selectedfrom, for example, photocurable and/or heat-curable pressure-sensitiveadhesive composition(s), which is the same as described in the firstembodiment.

The packaging film 300′ may be adhered at least between the secondregion 320 and the side surfaces 102 and 202, and/or between the thirdregion 330 and the bottom surface 203 by fusion through heat and/orlight or adhesion through the pressure-sensitive adhesive layer asdescribed above.

In addition, the adhesive means may be, in another example, adouble-sided or single-sided pressure-sensitive adhesive tape. Here, thedouble-sided pressure-sensitive adhesive tape may be interposed betweenthe packaging film 300′ and the panel 100/diode 200. Preferably, thedouble-sided pressure-sensitive adhesive tape may be interposed betweenthe second region 320 and the side surfaces 102 and 202, and/or betweenthe third region 330 and the bottom surface 203. In addition, thesingle-sided pressure-sensitive adhesive tape may be taped on an outersurface of the third region 330 to provide binding strength to thebackward diode 200.

According to an exemplary embodiment, to provide strong fixing strengthbetween the display panel 100 and the backward diode 200, thepressure-sensitive adhesive layer may be formed therebetween. Thepressure-sensitive adhesive layer is the same as the pressure-sensitiveadhesive layer 400 according to the first embodiment, and thus thedescription thereof will be omitted.

Referring to FIGS. 13 and 14, a notch part 350 may be formed on theboundary line C1 between the first region 310 and the second region 320.In addition, when the packaging film 300′ further includes the thirdregion 330, the notch part 350 may be formed on the boundary line C2between the second region 320 and the third region 330. FIG. 14 is across-sectional diagram taken along line A-A′ of FIG. 13.

The notch part 350 is the same as described in the first embodiment. Thenotch part 350 is preferably any one that allows the second and thirdregions 320 and 330 to be easily bent on the boundary lines C1 and C2.The notch part 350 may be formed through notch treatment capable ofproducing a difference in thickness, for example, at the boundary linesC1 and C2. Specifically, the notch part 350 may be selected from afolding line imprinted part formed by pressing the boundary line C1 orC2, and a half cut part formed by half-cutting the boundary line C1 orC2. In the present application, the half does not mean only a “half” ofthe thickness of the packaging film 300′.

The notch part 350 may be formed to a depth of, for example, ⅓ to ⅔ ofthe thickness of the packaging film 300′ by the folding line imprintingor half-cutting, but the present application is not limited thereto. Inaddition, the notch part 350 may be continuously formed along theboundary lines C1 and C2, or discontinuously formed at a predeterminedinterval.

In addition, the notch part 350 may have an elongation of 50 to 80% ofan elongation before forming the notch part 350. Particularly, when thenotch treatment (e.g., the folding line imprinting) is performed on theboundary lines C1 and C2, the elongation of the notch part 350 may be 50to 80% of that before the notch treatment. For example, when it isassumed that the elongation of the packaging film 300′ is set to 100%(two times of initial), the elongation of the notch part 350 is 50 to80% of the elongation of the packaging film 300′ before the notchtreatment, which means 1.0 to 1.8 times of initial (that is, elongationof 50 to 80%). When such a notch part 350 exceeds the above range, forexample, it may be difficult to bend or may break.

A thickness of the packaging film 300′ is not specifically limited. Thethickness of the packaging film 300′ may vary depending on a supportingstrength, bending processability of each region 310, 320 and 330,handleability in packaging, and/or thinning of the film 300′. Accordingto an exemplary embodiment, the thickness of the packaging film 300′ maysatisfy an area of the first region 310 and Equation 3. The thickness ofthe packaging film 300′ may depend on the area of the first region 310,and is preferably, for example, in the range of approximately 50 to 500μm, 60 to 400 μm, or 80 to 200 μm.

In addition, the packaging film 300′ may have at least one mechanicalproperty selected from, for example, (a) a tensile modulus of 1,200 MPa,(b) a tensile strength of 40 MPa or more, and (c) an elongation of 20%or more. When the packaging film 300′ has such physical properties, itcan package and support the display panel 100 and the backward diode 200well.

The packaging film 300′ preferably has small strain for high supportingstrength, fixing strength and/or durability. The packaging film 300′preferably has a strain (E) according to Equation 4 of, for example, 5%or less.

In addition, referring to FIG. 13, the third region 330 may have anoverlap prevented part 360. That is, when the third region 330 is bentto be adhered to the bottom surface 203 of the backward diode 200, anoverlap prevented part 360 may be formed in the third region 330 not tooverlap adjacent third regions 330.

The overlap prevented part 360 may be selected from, for example, anotched part 361 cut at a predetermined angle (θ). Here, the angle (θ)of the notched part 361 may be, for example, 15 to 85 degrees, or 30 to60 degrees, and preferably, 30 degrees or more, or 45 degrees or more.Due to such a notched part 361, the overlap with an adjacent thirdregion 330 may be prevented. In the present application, the angle (θ)of the notched part 361 means an inclined angle made between anelongation line (a) and the side surface of the third region 360 basedon the elongation line (a) elongated in a straight line direction fromthe second region 320 as shown in FIG. 13.

FIG. 15 shows another example of the overlap prevented part 360.Referring to FIG. 15, the overlap prevented part 360 may be selectedfrom a cut part 362 cut out in a predetermined length (L) and removed.Here, the length (L) of the cut part 362 may be, for example, largerthan or the same as a width (W₃₃₀) of an adjacent third region 330. Theoverlap with the adjacent third region 330 may be prevented by such acut part 362.

At least the first region 310 of the regions 310, 320 and 330 of thepackaging film 300′ has light transmittance (transparency). The firstregion 310 may have, for example, a light transmittance of 80% or more,preferably, for example, 90% or more, 95% or more, or 98% or more.

In addition, the bottom surface of the first region 310, that is, asurface (a lower surface in the drawing) in contact with the displaypanel 100, may have a ribbed surface in some cases. Due to such a ribbedsurface, after packaging, fusion between the first region 310 and thedisplay panel 100 may be prevented. Preferably, referring to FIG. 11,fusion between the bottom surface (the lower surface in the drawing) ofthe first region 310 and the top surface (the upper surface in thedrawing) of the upper polarizing plate 140 may be prevented due to theribbed surface. The ribbed surface may be formed through variousmethods, which are the same as explained in the first embodiment.

According to an exemplary embodiment, an optical layer or anotherfunctional layer may be formed on at least one selected from the topsurface (upper part in the drawing) and the bottom surface (lower partin the drawing) of the first region 310. Particularly, at least onefunctional layer selected from, for example, a polarizing layer, a lightdiffusion layer, a viewing angle compensation layer, a retardationlayer, an anti-reflection layer, an anti-glare layer and a protectivefilm for protecting these may be formed on the top and/or bottomsurface(s) of the first region 310. Such a functional layer may bestacked on the first region 310, or may be directly formed on a surfaceof the first region 310 as a separate member. For example, thepolarizing layer may be formed by adhering a light diffusing film to thefirst region 310, and the anti-reflection layer may be formed by coatingan anti-reflective material on the first region 310. In another example,the anti-glare layer may be directly formed on an upper surface of thefirst region 310 through surface treatment such as haze treatment.

The packaging film 300′ may include at least a polarizing layer formedon the first region 310 according to an exemplary embodiment. Accordingto another exemplary embodiment, the packaging film 300′ may include atleast a polarizing layer formed on the first region 310, and apressure-sensitive adhesive layer formed on the polarizing layer. Here,the pressure-sensitive adhesive layer may include the pressure-sensitiveadhesive composition described in the first embodiment, thereby havingthe physical properties described in the first embodiment. In addition,a releasing paper may be adhered to the pressure-sensitive adhesivelayer. The releasing paper may be any one that can protect thepressure-sensitive adhesive layer without specific limitation, and maybe, for example, a resin film or paper having releasability.

Meanwhile, at least the second region 320 among the second and thirdregions 320 and 330 may have light impermeability. That is, the secondregion 320 is any one that can prevent light leakage to a side surfacesince the second region 320 has light impermeability. The second region320 may have light transmittance of, for example, 10% or less, 5% orless, 1% or less, 0.1% or less, or 0%. According to a more particularembodiment, at least the second flap 322 of the first and second flaps321 and 322 of the second region 320 preferably has lightimpermeability. In this case, it is preferable that the backward diode200 be an optical diode 200A.

For light impermeability, the second region 320 may include, forexample, at least one light leakage preventing layer selected from alight shielding layer and a reflective layer, and the light leakagepreventing layer may be formed at least on the second flap 322. Inaddition, the third region 330 may selectively have lightimpermeability.

The light shielding layer may be formed, for example, by coating a lightshielding material on the second region 320. In addition, the reflectivelayer may be formed, for example, by coating a reflective material onthe second region 320. The materials constituting each of the lightshielding layer and the reflective layer are not specifically limited,and are the same as described in the first embodiment.

In addition, according to an exemplary embodiment, in at least thesecond region 320 of the regions 310, 320 and 330, a moisture blockingbarrier layer for preventing penetration of external moisture may beformed. Specifically, the packaging film 300′ also has the moistureblockage by itself, but to effectively block moisture, the barrier layermay be further formed in the second region 320.

It is preferable that the barrier layer be able to prevent thepenetration of external moisture into the display panel 100. To thisend, the barrier layer may be formed at a location corresponding to atleast the first flap 321 in the second region 320, and may haveimpermeability to a gas such as air, in addition to the moistureimpermeability (moisture blockage) to prevent penetration of a gas suchas external air, in addition to blocking moisture such as humidity.

The barrier layer is not specifically limited, as long as it at leasthas moisture blockage. The barrier layer may be formed on at least oneselected from an inner surface of the second region 320 and an outersurface of the second region 320. Such a barrier layer may include, forexample, at least one selected from a moisture blocking resin layer, ametal thin film, and a deposition layer.

The moisture blocking resin layer may be, for example, a film layerformed by adhering a moisture blocking resin film to the second region320 or the side surface 102 of the display panel 100, or a resin coatinglayer formed by coating a moisture blocking resin composition on thesecond region 320 or the side surface 102 of the display panel 100.

The resin composition constituting the moisture blocking resin layer, ametal constituting a metal thin film, and an oxide constituting adeposition layer are not specifically limited, and are the same asdescribed in the first embodiment.

Referring to FIG. 16, a light impermeable part 314 may be formed at anedge of the first region 310. As shown in FIG. 16, the first region 310may have a light permeable (transparent) main region 312, and a lightimpermeable part 314 along a circumference of the main region 312. It ispreferable that the light impermeable part 314 have light impermeability(light leakage blockage), and be the same as described in the firstembodiment. The light impermeable part 314, as described in the firstembodiment, may be selected from, for example, a printed layer formed bybeing printed with a light impermeable paint. Moreover, the lightimpermeable part 314 may be selected from the light shielding layer andthe reflective layer as described above.

When the light impermeable part 314 is formed at the edge of the firstregion 310 as described above, light leakage to the side surface may betotally prevented. Since the second region 320 has light impermeability,the light leakage to the side surface is prevented, but for example, inthe bending process of the packaging film 300′, the packaging film 300′may not be exactly bent at the boundary lines C1 and C2, and may haveallowance in some cases, thereby causing light leakage to the sidesurface. In addition, the first region 310 is lopsided in the packagingby the packaging film 300′, and thus the edge of the first region 310 isplaced on the side surface 202 of the optical diode 200A, resulting inthe light leakage to the side surface. In such a case, as the light isblocked by the light impermeable part 314, the light leakage to the sidesurface may not be totally prevented. A width (W₃₁₄) and a thickness ofthe light impermeable part 314 are not specifically limited, and are thesame as described in the first embodiment.

In addition, referring to FIG. 17, according to an exemplary embodiment,the first region 310 may include a projecting part 315 from which thesecond region 320 does not extend. Particularly, as shown in FIG. 17,the second region 320 extends from the first region 310, not from avertex 310 a of the first region 310, to have a step difference 316, andthus the first region 310 may include the projecting part 315. That is,the vertex 310 a of the first region 310 may project.

When the projecting part 315 is included as described above, that is,the projecting part 315 from which the second region 320 does not extendis included in the first region 310, a stress may be prevented while thesecond region 320 is bent. Depending on the mechanical properties orthickness of the packaging film 300′, as shown in FIG. 13, when there isno projecting part 315 having a projecting vertex 310 a, a stress may beapplied to the vertex 310 a of the first region 310 when the secondregion 320 is bent, and thus the separation phenomenon may occur aroundthe vertex 310 a. However, when the projecting part 315 is included,such a separation phenomenon may be prevented.

According to the second embodiment of the present application describedabove, an improved display device is embodied. As the display panel 100and a backward diode 200 are fixed through packaging by the packagingfilm 300′, for example, a bezel region is minimized. That is, since theuse of a molding frame to fix the display panel 100 and the backwarddiode 200 is excluded, a bezel-free display device having almost nobezel may be embodied.

In addition, consumption of too much time and damage to the opticaldiode 200A, which can occur in handling and assembly of the backwarddiode 200, for example, the optical diode 200A on a film (or sheet), maybe prevented. Moreover, the display panel 100 and the backward diode 200are packaged by the packaging film 300′, thereby preventing thepermeability of external moisture or air. In addition, the optical diode200A is packaged by the packaging film 300′ to have sealability, therebypreventing the light leakage phenomenon.

Hereinafter, Examples and Comparative Examples will be illustrated.Here, the following Comparative Examples are merely provided forcomparison with Examples, and are not excluded from the scope of thepresent application.

Examples 1 and 2 and Comparative Examples 1 and 2

A display panel and a back-side module (equipped with a BLU) embodying a24-inch monitor were prepared and packaged with a PC film. Here, thefilm had various thicknesses according to Examples and ComparativeExamples. Particularly, in Examples 1 and 2, films satisfying Equations1 and 2 had thicknesses of 38 μm (Example 1) and 75 μm (Example 2),respectively. In addition, in Comparative Examples 1 and 2, films notsatisfying Equation 3 had thicknesses of 25 μm (Comparative Example 1)and 250 μm (Comparative Example 2), respectively.

T [μm]=100×S [m² ]+a  [Equation]

Here, T is a thickness (μm) of the PC film, S is a panel area (0.165 m²)of a monitor, and a is a number from 15 to 130.

After the packaged monitor was installed to be inclined approximately 10degrees toward a wall, and maintained at 60° C. for 24 hours, a degreeof drooping a display panel of the monitor was evaluated. In addition,during packaging, it was evaluated whether there were separated partsbetween the monitor and the film. The results of this are shown in Table1.

TABLE 1 <Results for evaluating degree of drooping and separationphenomenon> Comparative Comparative Category Example 1 Example 2 Example1 Example 2 Thickness 38 μm 75 μm 25 μm 250 μm of PC film Area of 0.165m² 0.165 m² 0.165 m² 0.165 m² 24-inch monitor Degree of None NoneDrooping None drooping (2 mm or after more) monitor installationSeparation None None None Generation phenomenon of separated part

As shown in Table 1, it was seen that, in Examples 1 and 2 in which therelationship between a thickness and an area satisfied the aboveEquation, no drooping phenomenon or separation phenomenon occurred afterthe monitor was installed. However, it was seen that, in ComparativeExample 1 that did not satisfy the above Equation and had a thicknessthat was too small compared to the area of the monitor, a droopingphenomenon occurred, and in Comparative Example 2 in which the thicknesswas too large, no drooping phenomenon occurred, but a separated part wasgenerated.

Examples 3 and 4 and Comparative Example 3

Various kinds of films were prepared according to Examples 3, and 4, andComparative Example 3, and strains (E) were first measured according tothe following Equation. Here, each of the films according to Examplesand Comparative Examples had a size of 60 mm×25 mm (width×length) and athickness of 125 μm, and thus the films had the same size and thickness.The films were classified into a PC film (Example 3), a PET film(Example 4), and a polyethylene (PE) film (Comparative Example 3).

E (%)=[(L2−L1)/L1]×100  [Equation]

Here, L1 is the initial length of a film (60 mm), and L2 is a lengthextending after the film was maintained for 24 hours at 80° C. under aload of 3 kg.

Afterward, an LCD panel for embodying a 55-inch LCD TV and a back-sidemodule (equipped with an BLU) were prepared, and packaged with each ofthe films according to Examples 3 and 4 and Comparative Example 3. Inaddition, the packaged LCD TV was installed to be inclined to a wall atan angle of 10 degrees and maintained at 60° C. for 24 hours, and then adegree to which the LCD panel projected forward was evaluated. Here, thedegrees of projection were detected by 10 persons with the naked eye,and when one or none of the 10 persons detected the projection, it wasindicated as “good,” and when at least two of the 10 persons detectedthe projection, it was indicated as “fail.” The results are shown inTable 2.

TABLE 2 <Results for evaluating strain> Comparative Categories Example 3Example 4 Example 3 Kind of film PC film PET film PE film (125 μm) (125μm) (125 μm) Extending length 0.83 mm 0.32 mm 5 mm [L2] (80° C., load of3 kg) Strain [E] 1.4% 0.5% 8.3% Projection degree, Good Good Fail afterinstallation (Detected by (Detected by (Detected by (60° C., after noneof 10 none of 10 3 of 10 24 hours) persons) persons) persons)

As shown in Table 2, in Examples 3 and 4 using the films having lowstrains (E), it was seen that, after the installation on the wall, theprojection phenomenon did not occur.

Meanwhile, the following Examples and Comparative Examples are exemplaryExperimental Examples for a pressure-sensitive adhesive layer. In thefollowing Examples and Comparative Examples, methods of measuringphysical properties are as follows.

[Measurement Methods]

1. Room Temperature Storage Modulus

A coated sample was cut to a size of 15 cm×25 cm (width×length), a PCfilm was removed by peeling. In addition, the sample was placed on aparallel plate of a dynamic pressure-sensitive adhesion measuringdevice, a gap was adjusted, normal and torque were set to zero,stabilization of normal force was identified, and then a roomtemperature storage modulus was measured. A particular measuring deviceand measuring conditions are as follows.

-   -   Measuring device: ARES-RDA, TA Instruments Inc. with forced        convection oven    -   Measuring conditions        -   geometry: 8 mm parallel plate        -   gap: around 1 mm        -   test type: dynamic strain frequency sweep        -   strain=5.0[%]        -   temperature: room temperature (25° C.)        -   initial frequency: 0.1 rad/s, final frequency: 100 rad/s

2. Separation Phenomenon

A degree of separation between the PC film and the pressure-sensitiveadhesive layer was observed with a microscope after a coated samplehaving a size of 15 cm×25 cm (width×length) was put into a constanttemperature/constant humidity container at 60° C. and a humidity of 90%for 240 hours. When there was no separation, it was indicated as “good,”and when the separation occurred, it was indicated as “separated.”

3. Dislocated Distance

A coated sample was cut to a size of 25 cm×25 cm (width×length) andmaintained at a room temperature (approximately 15° C.) and 80° C. undera load of 1 kgf for 4 hours, and a dislocated distance between the PCfilm and the pressure-sensitive adhesive layer was evaluated using amicroscope.

4. Peeling Strength (Pressure-Sensitive Adhesive Strength)

A coated sample was cut to a size of 15 cm×25 cm (width×length), andpeeling strength (adhesive strength) was evaluated with respect to anadhesive surface between the PC film and the pressure-sensitive adhesivelayer was evaluated using a texture analyzer (TA) at room temperature, apeeling angle of 180 degrees and a peeling rate of 30 mm/min.

Examples 5 to 8 and Comparative Examples 4 to 6

An acrylic pressure-sensitive adhesive resin was synthesized withcomponents and in contents shown in Table 3, a curing agent was mixed,and the resulting mixture was coated on a PC film and cured, therebyforming a pressure-sensitive adhesive layer.

A room temperature storage modulus, a separation phenomenon and adislocated distance (at room temperature and 80° C.) of the coatingsample were evaluated, and the results are shown in Table 3.

TABLE 3 <Results for evaluating characteristics of pressure-sensitiveadhesive layer> Comparative Comparative Comparative Categories Example 5Example 6 Example 7 Example 8 Example 4 Example 5 Example 6 Pressure-EHA/MA/AA EHA/MA/AA EHA/MA/AA EHA/MA/AA EHA/MA/AA EHA/MA/AA BA/AAsensitive 65/25/10 65/25/10 68/25/7 68/25/7 65/25/10 68/25/7 96/4adhesive resin (parts by weight) Mw 1,700,000 1,450,000 1,800,0001,430,000 760,000 760,000 1,750,000 Curing agent 0.015 0.015 0.015 0.0150.015 0.1 0.015 (parts by weight) G′ 8.4 8.3 7.9 6.8 4.1 4.8 5.2 Degreeof 56% 49% 58% 46% 4.5% 82% 71% crosslinking (%) Separation Good GoodGood Good Good Separated Separated Dislocated 0 0 0 0 1.5 mm 0 0.5 mmdistance (room temperature) Dislocated 0.41 0.48 0.62 0.76 Dislocated0.43 1.7 mm distance and (80° C.) detached EHA: 2-ethylhexyl acrylateMA: methyl acrylate AA: acrylic acid BA: butyl acrylate Mw: weightaverage molecular weight of pressure-sensitive adhesive resin Curingagent: epoxy curing agent, based on 100 parts by weight ofpressure-sensitive adhesive resin G′: room temperature storage modulus(×10⁵ dyn/cm²)

As shown in Table 3, it was seen that the physical properties werechanged according to a room temperature storage modulus (G′), a contentof the curing agent and a crosslinking agent, and the samples accordingto Examples had no separation after being maintained at a hightemperature/high humidity (60° C./90%) for a long time, and a dislocateddistance at room temperature and 80° C. of less than 1.0 mm, therebyexhibiting excellent cohesive strength.

Examples 9 to 12 and Comparative Examples 7 to 9

An acrylic pressure-sensitive adhesive resin was synthesized withcomponents and in contents shown in Table 4, a curing agent was mixed,and the resulting mixture was coated on a PC film and cured, therebyforming a pressure-sensitive adhesive layer.

A room temperature storage modulus, peeling strength (pressure-sensitiveadhesive strength), a separation phenomenon and a dislocated distance(at room temperature and 80° C.) of the coating sample were evaluated,and the results are shown in Table 4.

TABLE 4 <Results for evaluating characteristics of pressure-sensitiveadhesive layer> Comparative Comparative Comparative Categories Example 9Example 10 Example 11 Example 12 Example 7 Example 8 Example 9 Pressure-EHA/MA/AA BA/MA/AA BA/MA/HBA BA/IBOA/MA/HBA BA/HBA BA/AA BA/AA sensitive65/25/10 68/25/7 58/40/2 58/20/18/2 99/1 90/10 96/4 adhesive resin(parts by weight) Mw 1,450,000 1,450,000 1,200,000 1,150,000 1,700,0001,800,000 1,750,000 Curing 0.015 0.015 — — — 0.015 0.015 agent a (partsby weight) Curing — — 0.2 0.2 0.1 — — agent b (parts by weight) G′ 8.38.3 9.2 7.6 4.1 8.2 5.2 Peeling 1.55 0.86 1.32 1.63 0.16 0.43 0.25strength (kgf/cm) Separation Good Good Good Good Separated SeparatedSeparated Dislocated 0 0 0 0 0.6 mm 0 0.5 mm distance (room temperature)Dislocated 0.48 mm 0.48 mm 0.32 mm 0.35 mm 1.8 mm 0.43 mm 1.7 mmdistance (80° C.) EHA: 2-ethylhexyl acrylate MA: methyl acrylate AA:acrylic acid BA: butyl acrylate HBA: hydroxy butyl acrylate IBOA:isobornyl (meth)acrylate Mw: weight average molecular weight ofpressure-sensitive adhesive resin Curing agent (a): epoxy curing agent,based on 100 parts by weight of pressure-sensitive adhesive resin Curingagent (a): isocyanate curing agent, based on 100 parts by weight ofpressure-sensitive adhesive resin G′: room temperature storage modulus(×10⁵ dyn/cm²)

As shown in Table 4, it was seen that the samples according to Exampleshad no separation after being maintained at high temperature/highhumidity (60° C./90%) for a long time, and a dislocated distance at roomtemperature and 80° C. of less than 0.5 mm, thereby exhibiting excellentcohesive strength.

Examples 13 to 16 and Comparative Examples 10 to 13

An acrylic pressure-sensitive adhesive resin was synthesized withcomponents and in contents shown in Table 5, a curing agent was mixed,and the resulting mixture was coated on a PC film and cured, therebyforming a pressure-sensitive adhesive layer.

A room temperature storage modulus, peeling strength (pressure-sensitiveadhesive strength), separation and a dislocated distance (at roomtemperature and 80° C.) of the coating sample were evaluated, and theresults are shown in Table 5.

TABLE 5 <Results for evaluating characteristics of pressure-sensitiveadhesive layer> Example Example Example Example Comparative ComparativeComparative Comparative Categories 13 14 15 16 Example 10 Example 11Example 12 Example 13 Pressure- BA/HBA BA/AA EHA/MA/AA EHA/MA/AA BA/HBABA/AA EHA/MA/AA EHA/MA/AA sensitive 99/1 94/6 65/25/10 68/25/7 99/1 94/665/25/10 68/25/7 adhesive resin (parts by weight) Mw 1,700,000 1,760,0001,120,000 1,160,000 1,700,000 1,760,000 1,120,000 1,160,000 P 12 12 1212 0 0 0 0 Curing 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 agent G′ 1.7 × 10⁶ 6.5× 10⁶ 7 × 10⁶ 4.5 × 10⁶ 4.7 × 10⁵ 6.7 × 10⁵ 8.3 × 10⁵ 6.8 × 10⁵Separation Good Good Good Good Separated Separated Good Good Dislocated0 0 0 0 0.2 mm 0 0 0 distance (room temperature) Dislocated 0.17 mm 0.16mm 0.12 mm 0.15 mm 1.8 mm 0.43 mm 0.8 mm 1.1 mm distance (80° C.) BA:butyl acrylate AA: acrylic acid EHA: 2-ethylhexyl acrylate MA: methylacrylate HBA: hydroxy butyl acrylate Mw: weight average molecular weightof pressure-sensitive adhesive resin P: multifunctional acrylate(tris[2-acryloyloxy)ethyl] isocyanurate) was used as trifunctionalacrylate), based on 100 parts by weight of pressure-sensitive adhesiveresin Curing agent: isocyanate curing agent, based on 100 parts byweight of pressure-sensitive adhesive resin G′: room temperature storagemodulus(dyn/cm²)

As shown in Table 5, it was seen that the samples according to Exampleshad no separation after being maintained at high temperature/highhumidity (60° C./90%) for a long time, and a dislocated distance at roomtemperature and 80° C. of less than 0.2 mm, thereby exhibiting excellentcohesive strength.

According to the present application, an improved display device can beembodied. For example, a bezel region can be minimized. In addition, inmanufacture (assembly) of the display device, damage to components canbe prevented, and the process can be simplified.

While the invention has been shown and described with reference tocertain exemplary embodiments thereof, it will be understood by thoseskilled in the art that various changes in form and details may be madetherein without departing from the scope of the invention as defined bythe appended claims.

What is claimed is:
 1. A packaging film for a display device,comprising: a first region corresponding to a top surface of a backwarddiode equipped on a bottom surface of a display panel; and a secondregion extending from the first region and corresponding to a sidesurface of the backward diode.
 2. A packaging film for a display panel,comprising: a first region corresponding to a top surface of a displaypanel; and a second region extending from the first region andcorresponding to a side surface of the display panel and a side surfaceof a backward diode equipped on a bottom surface of the display panel.3. The film according to claim 1 or 2, further comprising: a thirdregion extending from the second region and corresponding to the bottomsurface of the backward diode.
 4. The film according to claim 1 or 2,wherein two to four second regions are included.
 5. The film accordingto claim 1 or 2, wherein the packaging film has an absolute value ofin-plane retardation (R_(in)) of 30 nm or less.
 6. The film according toclaim 1 or 2, wherein the packaging film has an absolute value ofthickness-direction retardation (R_(th)) of 35 nm or less.
 7. The filmaccording to claim 3, which has a notch part formed on a boundary linebetween the first and second regions, or a boundary line between thesecond and third regions.
 8. The film according to claim 3, wherein thefirst and second regions or the second and third regions have a bendingstrength of 1.0 to 10.0 gf on each boundary line.
 9. The film accordingto claim 1 or 2, wherein the packaging film has a thickness, whichsatisfies an area of the first region and the following Equation:T [μm]=100×S [m² ]+a  [Equation] where T is a thickness (μm) of thepackaging film, S is an area (m²) of the first region, and a is a numberfrom 15 to
 130. 10. The film according to claim 1 or 2, which has atleast one selected from the physical properties (a) to (c): (a) tensilemodulus of 1,200 MPa or more (b) tensile strength of 40 MPa or more (c)elongation of 20% or more.
 11. The film according to claim 1 or 2, whichhas a strain (E) according to the following Equation of 5% or less:E (%)=[(L2−L1)/L1]×100  [Equation] where L1 is an initial length of thepackaging film, and L2 is an extending length of the packaging filmafter being maintained for 24 hours by applying a load of 3 kg at 80° C.12. The film according to claim 3, wherein the third region has anoverlap prevented part for preventing overlap with an adjacent thirdregion when the third region is located to correspond to the bottomsurface of the backward diode through a bending process.
 13. The filmaccording to claim 1 or 2, wherein the second region islight-impermeable.
 14. The film according to claim 1 or 2, wherein alight-impermeable part is formed at an edge of the first region.
 15. Thefilm according to claim 1 or 2, wherein the first region includes aprojecting part from which the second region does not extend.
 16. Thefilm according to claim 1, wherein adhesive treatment is performed on atop surface of the first region.
 17. The film according to claim 1 or 2,wherein the second region has a ribbed bottom surface.
 18. The filmaccording to claim 1 or 2, wherein the packaging film includes at leastone selected from a polycarbonate-based resin, a polyester-based resin,a polyolefin-based resin, a cyclo-olefin polymer-based resin, anacryl-based resin, a urethane-based resin, an epoxy-based resin, apolyamide-based resin, a cellulose-based resin, a nylon-based resin anda derivative thereof.
 19. The film according to claim 1 or 2, furthercomprising: a pressure-sensitive adhesive layer formed on the firstregion.
 20. The film according to claim 19, wherein thepressure-sensitive adhesive layer has a room temperature storage modulusof 6.0×10⁵ dyn/cm² or more.
 21. The film according to claim 19, whereinthe pressure-sensitive adhesive layer has a peeling strength of 0.8kgf/cm or more when peeled at room temperature and a peeling rate of 30mm/min.
 22. The film according to claim 19, wherein thepressure-sensitive adhesive layer includes a photocurablepressure-sensitive adhesive composition, and has a room temperaturestorage modulus of 1.0×10⁶ dyn/cm² or more after curing.
 23. The filmaccording to claim 1 or 2, further comprising: a protective film formedon the first region; and a pressure-sensitive adhesive layer formed onthe protective film.
 24. The film according to claim 23, wherein theprotective film includes at least one selected from triacetyl cellulose(TAC) and an acrylic resin.